

INTEL EPM2210F324I5
Manufacturer No:
EPM2210F324I5
Manufacturer:
Package:
324-BGA
Description:
1.5/3.3,2.5/3.3 V 1 mm PMIC MAX® II Series EPM2210 324-BGA
Quantity:
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Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
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Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
EPM2210F324I5 Information
INTEL EPM2210F324I5 technical specifications, attributes, parameters and parts with similar specifications to INTEL EPM2210F324I5.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- 324-BGA
- Surface Mount
- YES
- Supplier Device Package
- 324-FBGA (19x19)
- Number of Terminals
- 324
- Number of Macrocells
- 1700
- Package Description
- BGA, BGA324,18X18,40
- Package Style
- GRID ARRAY
- Moisture Sensitivity Level
- 3
- Package Body Material
- PLASTIC/EPOXY
- Type
- Parameter
- Package Equivalence Code
- BGA324,18X18,40
- Supply Voltage-Nom
- 2.5 V
- Reflow Temperature-Max (s)
- 30
- Supply Voltage-Min
- 2.375 V
- RoHS Status
- Non-RoHS Compliant
- Manufacturer Part Number
- EPM2210F324I5
- Package Code
- BGA
- Package Shape
- SQUARE
- Manufacturer
- Intel Corporation
- Part Life Cycle Code
- Active
Download datasheets and manufacturer documentation for INTEL EPM2210F324I5.
EPM2210F324I5 Overview
In the mobile phone network, there are 1700macro cells, which are cells with high-power antennas and towers.The item is packaged with 324-BGA.As you can see, this device has 272 I/O ports programmed into it.This electrical part is wired with a terminal position of BOTTOM.This part is in the family Programmable Logic Devices.Tray should be used for packaging the chip.The operating temperature of the machine is -40°C ~ 100°C (TJ) to ensure its reliability.It is recommended that Surface Mount holds the chip in place.In FPGA terms, it is a type of MAX® II series FPGA.Additionally, this device is capable of displaying IT CAN ALSO OPERATE AT 3.3V.The EPM2210 contains its related parts.There are a total of 2210 logic elements or blocks.It runs on a voltage of 1.5/3.3,2.5/3.3 Vvolts.A programmable logic type is classified as FLASH PLD.
EPM2210F324I5 Features
324-BGA package
272 I/Os
The operating temperature of -40°C ~ 100°C (TJ)
1.5/3.3,2.5/3.3 V power supplies
EPM2210F324I5 Applications
There are a lot of ALTERA
EPM2210F324I5 CPLDs applications.
- Power up sequencing
- Voltage level translation
- Timing control
- Interface bridging
- I/O expansion
- Discrete logic functions
- Bootloaders for FPGAs
- Address decoders
- Custom state machines
- Digital systems
EPM2210F324I5 Relevant information
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