INTEL EPM2210F324C4
Manufacturer No:
EPM2210F324C4
Manufacturer:
INTEL
Package:
324-BGA
Description:
1.5/3.3,2.5/3.3 V 1 mm PMIC MAX® II Series EPM2210 324-BGA
Quantity:
In Stock :2873
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Shipped from：HK Warehouse
Expected Shipping：Fri, Jun 12 - Sat, Jun 13, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
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Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
EPM2210F324C4 Information
INTEL EPM2210F324C4 technical specifications, attributes, parameters and parts with similar specifications to INTEL EPM2210F324C4.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- 324-BGA
- Surface Mount
- YES
- Supplier Device Package
- 324-FBGA (19x19)
- Number of Terminals
- 324
- Number of Macrocells
- 1700
- Package Description
- BGA, BGA324,18X18,40
- Package Style
- GRID ARRAY
- Moisture Sensitivity Level
- 3
- Package Body Material
- PLASTIC/EPOXY
- Type
- Parameter
- Package Equivalence Code
- BGA324,18X18,40
- Supply Voltage-Nom
- 2.5 V
- Reflow Temperature-Max (s)
- 30
- Supply Voltage-Min
- 2.375 V
- Operating Temperature-Max
- 85 °C
- RoHS Status
- Non-RoHS Compliant
- Manufacturer Part Number
- EPM2210F324C4
- Package Code
- BGA
- Package Shape
- SQUARE
- Manufacturer
- Intel Corporation
Download datasheets and manufacturer documentation for INTEL EPM2210F324C4.
EPM2210F324C4 Overview
1700 macrocells are present in the mobile phone network, which offer radio coverage from a high-power cell tower, antenna, or mast.The item is enclosed in a 324-BGA package.The device is programmed with 272 I/O ports.There is a BOTTOM terminal position on the electrical part in question.It is a part of the family Programmable Logic Devices.It is recommended that the chip be packaged by Tray.Ensure its reliability by operating at 0°C ~ 85°C (TJ).It is recommended to mount the chip by Surface Mount.FPGAs belonging to the MAX® II series contain this type of chip.When using this device, IT CAN ALSO OPERATE AT 3.3V is also available.You can find its related parts in the EPM2210.2210 logic elements/blocks exist.A power supply of 1.5/3.3,2.5/3.3 V volts is required to operate this device.In programmable logic, a type of logic can be categorized as FLASH PLD.
EPM2210F324C4 Features
324-BGA package
272 I/Os
The operating temperature of 0°C ~ 85°C (TJ)
1.5/3.3,2.5/3.3 V power supplies
EPM2210F324C4 Applications
There are a lot of ALTERA
EPM2210F324C4 CPLDs applications.
- Digital systems
- Portable digital devices
- Handheld digital devices
- Battery operated portable devices
- Complex programmable logic devices
- Digital designs
- Field programmable gate
- Address decoding
- D/T registers and latches
- Synchronous or asynchronous mode
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
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