INTEL EPM1270F256C4N
Manufacturer No:
EPM1270F256C4N
Manufacturer:
Package:
256-BGA
Description:
1.5/3.3,2.5/3.3 V 1 mm PMIC MAX® II Series EPM1270 256-BGA
Quantity:
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EPM1270F256C4N Information
INTEL EPM1270F256C4N technical specifications, attributes, parameters and parts with similar specifications to INTEL EPM1270F256C4N.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- 256-BGA
- Surface Mount
- YES
- Supplier Device Package
- 256-FBGA (17x17)
- Number of Terminals
- 256
- Number of Macrocells
- 980
- Package Description
- BGA, BGA256,16X16,40
- Package Style
- GRID ARRAY
- Moisture Sensitivity Level
- 3
- Package Body Material
- PLASTIC/EPOXY
- Type
- Parameter
- Package Equivalence Code
- BGA256,16X16,40
- Supply Voltage-Nom
- 2.5 V
- Reflow Temperature-Max (s)
- 40
- Supply Voltage-Min
- 2.375 V
- Operating Temperature-Max
- 85 °C
- RoHS Status
- RoHS Compliant
- Manufacturer Part Number
- EPM1270F256C4N
- Package Code
- BGA
- Package Shape
- SQUARE
- Manufacturer
- Intel Corporation
Download datasheets and manufacturer documentation for INTEL EPM1270F256C4N.
Product Description:
The EPM1270F256C4N is a high-performance, complex programmable logic device (CPLD) from Altera, now part of Intel Corporation. This device is a member of the MAX II series and is designed for a wide range of applications, including digital signal processing, data acquisition, and control systems.
Features:
- 980 macrocells for complex logic and memory functions
- 212 I/O lines for high-speed data transfer
- Operating temperature range of 0°C to 85°C (TJ)
- In-system programmable using JTAG interface
- Supports multiple voltage supplies: 1.5V, 2.5V, and 3.3V
- Compact 256-pin BGA package with a 17x17mm footprint
- Surface-mount packaging for easy integration into PCBs
- RoHS compliant and Reach-compliant
Applications:
- Digital signal processing and filtering
- Data acquisition and control systems
- Industrial automation and control
- Medical devices and equipment
- Automotive systems and components
Alternative Parts:
- EPM1270F256C4N is a direct replacement for the EPM1270F256C4N-25I
- Other alternative parts include the EPM1270F256C4N-25I and the EPM1270F256C4N-25I-25I
Embedded Modules:
- The EPM1270F256C4N is used in various embedded modules, including:
- Altera's MAX II development board
- Intel's Cyclone IV development board
- Other third-party embedded modules
Frequently Asked Questions (FAQs):
Q: What is the maximum operating temperature of the EPM1270F256C4N? A: The maximum operating temperature is 85°C (TJ).
Q: Can the EPM1270F256C4N operate at 3.3V? A: Yes, the device can also operate at 3.3V.
Q: What is the maximum propagation delay of the EPM1270F256C4N? A: The maximum propagation delay is 8.1 ns.
Q: Is the EPM1270F256C4N RoHS compliant? A: Yes, the device is RoHS compliant.
Q: What is the package style of the EPM1270F256C4N? A: The package style is GRID ARRAY.
Q: What is the technology used in the EPM1270F256C4N? A: The technology used is CMOS.
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