INTEL EPM1270F256C4
Manufacturer No:
EPM1270F256C4
Manufacturer:
INTEL
Package:
256-BGA
Description:
1.5/3.3,2.5/3.3 V 1 mm PMIC MAX® II Series EPM1270 256-BGA
Quantity:
In Stock :6627
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Shipped from：HK Warehouse
Expected Shipping：Sun, Jun 14 - Mon, Jun 15, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
EPM1270F256C4 Information
INTEL EPM1270F256C4 technical specifications, attributes, parameters and parts with similar specifications to INTEL EPM1270F256C4.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- 256-BGA
- Surface Mount
- YES
- Supplier Device Package
- 256-FBGA (17x17)
- Number of Terminals
- 256
- Number of Macrocells
- 980
- Package Description
- BGA, BGA256,16X16,40
- Package Style
- GRID ARRAY
- Moisture Sensitivity Level
- 3
- Package Body Material
- PLASTIC/EPOXY
- Type
- Parameter
- Package Equivalence Code
- BGA256,16X16,40
- Supply Voltage-Nom
- 2.5 V
- Reflow Temperature-Max (s)
- 30
- Supply Voltage-Min
- 2.375 V
- Operating Temperature-Max
- 85 °C
- RoHS Status
- Non-RoHS Compliant
- Manufacturer Part Number
- EPM1270F256C4
- Package Code
- BGA
- Package Shape
- SQUARE
- Manufacturer
- Intel Corporation
Download datasheets and manufacturer documentation for INTEL EPM1270F256C4.
EPM1270F256C4 Overview
There are 980 macro cells, which are cells in a mobile phone network that provides radio coverage served by a high-power cell site (tower, antenna or mast).It is embedded in the 256-BGA package.It is programmed with 212 I/Os.The terminal position of this electrical part is BOTTOM, which serves as an important access point for passengers or freight.This part is included in Programmable Logic Devices.It is packaged in the way of Tray.It operates with the operating temperature of 0°C ~ 85°C (TJ) to ensure its reliability.It is mounted in the way of Surface Mount.It is a type of FPGA belonging to the MAX® II series.It is also characterized by IT CAN ALSO OPERATE AT 3.3V.According to the EPM1270, its related parts can be found.There are 1270 logic elements/blocks, which are fundamental building blocks of field-programmable gate array (FPGA) technology.It operates from 1.5/3.3,2.5/3.3 V power supplies.This kind of FPGA is composed of FLASH PLD.
EPM1270F256C4 Features
256-BGA package
212 I/Os
The operating temperature of 0°C ~ 85°C (TJ)
1.5/3.3,2.5/3.3 V power supplies
EPM1270F256C4 Applications
There are a lot of ALTERA
EPM1270F256C4 CPLDs applications.
- Power up sequencing
- Voltage level translation
- Timing control
- Interface bridging
- I/O expansion
- Discrete logic functions
- Bootloaders for FPGAs
- Address decoders
- Custom state machines
- Digital systems
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
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