Rochester EPF8820ARC208-3
Manufacturer No:
EPF8820ARC208-3
Manufacturer:
Rochester
Package:
208-BFQFP Exposed Pad
Description:
4.1mm mm FPGAs FLEX 8000 Series 208-BFQFP Exposed Pad 0.5mm mm 208
Quantity:
In Stock :3156
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
Shipping & Availability
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Shipped from：HK Warehouse
Expected Shipping：Thu, May 28 - Fri, May 29, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
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Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
EPF8820ARC208-3 Information
Rochester EPF8820ARC208-3 technical specifications, attributes, parameters and parts with similar specifications to Rochester EPF8820ARC208-3.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- 208-BFQFP Exposed Pad
- Surface Mount
- YES
- Operating Temperature
- 0°C~70°C TA
- Packaging
- Tray
- Series
- FLEX 8000
- JESD-609 Code
- e0
- Pbfree Code
- no
- Part Status
- Obsolete
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Type
- Parameter
- Number of Terminations
- 208
- Terminal Finish
- TIN LEAD
- Technology
- CMOS
- Voltage - Supply
- 4.75V~5.25V
- Terminal Position
- QUAD
- Terminal Form
- GULL WING
- Peak Reflow Temperature (Cel)
- 220
- Supply Voltage
- 5V
- Terminal Pitch
- 0.5mm
- Time@Peak Reflow Temperature-Max (s)
- 30
Download datasheets and manufacturer documentation for Rochester EPF8820ARC208-3.
EPF8820ARC208-3 Overview
Fpga chips is supplied in the 208-BFQFP Exposed Pad package. This kind of FPGA is composed of LOADABLE PLD. Fpga chips is programmed wFpga chipsh 152 I/Os for transferring data in a more coherent manner. There are 672 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 5V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 4.75V~5.25V. It is a type of FPGA belonging to the FLEX 8000 seies. The operating temperature should be kept at 0°C~70°C TA when operating. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 208 terminations. This FPGA is built as an array of 84 LABs/CLBs. Its basic building block contains 8000 gates. Fpga semiconductor is equipped wfpga semiconductorh 208 pin count. There are 4 dedicated inputs used to detect the status of input signals.
EPF8820ARC208-3 Features
152 I/Os
EPF8820ARC208-3 Applications
There are a lot of Rochester Electronics, LLC
EPF8820ARC208-3 FPGAs applications.
- Digital signal processing
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
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