INTEL EPF6024ABC256-1

Manufacturer No:

EPF6024ABC256-1

Manufacturer:

INTEL

Package:

256-BBGA

Description:

FPGAs FLEX 6000 Series 256-BBGA 1.27 mm mm

Quantity:

In Stock :6691

Looking for price or availability? Send us an RFQ and our sales team will respond quickly.

Shipping & Availability

Fast worldwide shipping via DHL, FedEx, UPS, and EMS.

Shipped from：HK Warehouse

Expected Shipping：Sun, Jun 7 - Mon, Jun 8, 2026

Lead Time：Inquire about availability

Date Code：Within 2 Years

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Certified in-house inspection and testing facilities ensure all components meet internationally recognized quality standards.

User Guide

Available from AS9120 Certified Supplier, AIChipLink delivers high-reliability electronic components supported by certified quality management, rigorous inspection processes, counterfeit mitigation controls, and full traceability systems. Our operations comply with AS9120, ISO 9001:2015, and IECQ ESD standards to support aerospace, industrial, defense, and mission-critical applications.

PURCHASE

Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.

MEANS OF PAYMENT

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RFQ (REQUEST FOR QUOTATIONS)

Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1：Prepare product

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step4：Individual Package

Step5：Anti-collision Filling

Step6：Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

EPF6024ABC256-1 Information

INTEL EPF6024ABC256-1 technical specifications, attributes, parameters and parts with similar specifications to INTEL EPF6024ABC256-1.

Type
Parameter

Mounting Type
Surface Mount

Package / Case
256-BBGA

Surface Mount
YES

Supplier Device Package
256-BGA (27x27)

Number of Terminals
256

Package Description
BGA, BGA256(UNSPEC)

Package Style
GRID ARRAY

Moisture Sensitivity Level
3

Package Body Material
PLASTIC/EPOXY

Package Equivalence Code
BGA256(UNSPEC)

Type
Parameter

Supply Voltage-Nom
3.3 V

Reflow Temperature-Max (s)
30

Supply Voltage-Min
3 V

Operating Temperature-Max
85 °C

RoHS Status
Non-RoHS Compliant

Manufacturer Part Number
EPF6024ABC256-1

Clock Frequency-Max
172 MHz

Package Code
BGA

Package Shape
SQUARE

Manufacturer
Intel Corporation

Download datasheets and manufacturer documentation for INTEL EPF6024ABC256-1.

EPF6024ABC256-1 Overview

Fpga chips is supplied in the 256-BBGA package. This kind of FPGA is composed of LOADABLE PLD. Fpga chips is programmed wFpga chipsh 218 I/Os for transferring data in a more coherent manner. There are 1960 logic elements/cells to form a fundamental building block. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 3 V ~ 3.6 V. It is a type of FPGA belonging to the FLEX 6000 seies. The operating temperature should be kept at 0°C ~ 85°C (TJ) when operating. There are 218 outputs incorporated in this device. Its base part number EPF6024 can be used to find related parts. This FPGA is built as an array of 196 LABs/CLBs. Fpga electronics operates from a 2.5/3.3,3.3 V power supply. Its basic building block contains 24000 gates. Fpga semiconductor incorporates 1960 logic cells used for the building block. It employs 256-BGA (27x27) as its supplier device package. Fpga semiconductor is also characteriCAN ALSO BE USED 24000 LOGIC GATESed by a feature called CAN ALSO BE USED 24000 LOGIC GATES. There are 4 dedicated inputs used to detect the status of input signals. There are 256 terminals used for its configuration.