INTEL EP3SL200H780C3
Manufacturer No:
EP3SL200H780C3
Manufacturer:
INTEL
Package:
780-BBGA, FCBGA
Description:
FPGAs Stratix® III L Series 780-BBGA, FCBGA 1mm mm 780
Quantity:
In Stock :2381
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Shipped from：HK Warehouse
Expected Shipping：Tue, Jun 2 - Wed, Jun 3, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
EP3SL200H780C3 Information
INTEL EP3SL200H780C3 technical specifications, attributes, parameters and parts with similar specifications to INTEL EP3SL200H780C3.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- 780-BBGA, FCBGA
- Surface Mount
- YES
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Stratix® III L
- JESD-609 Code
- e1
- Part Status
- Not For New Designs
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 780
- Type
- Parameter
- Terminal Finish
- TIN SILVER COPPER
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
- Voltage - Supply
- 0.86V~1.15V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Terminal Pitch
- 1mm
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Base Part Number
- EP3SL200
Download datasheets and manufacturer documentation for INTEL EP3SL200H780C3.
EP3SL200H780C3 Overview
A 780-BBGA, FCBGA package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 488 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 200000 logic elements/cells. A Field Programmable Gate Arrays-series FPGA part. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 0.86V~1.15V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Stratix® III L series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In order to make this device as versatile as possible, there are 488 different outputs included. It is for space saving reasons that this FPGA model is contained in Tray. As a whole, it has 780 terminations. The RAM bits that are offered by this fpga chips are 10901504. Related parts can be found by using its base part number EP3SL200. Fpga electronics contains 8000 LABs/CLBs in an array. Powered by a 1.2/3.3V power supply, it can be operated by almost anyone. Normally, fpga semiconductor uses an oscillator, which oscillates at 100MHz, to create the signal.
EP3SL200H780C3 Features
488 I/Os
Up to 10901504 RAM bits
EP3SL200H780C3 Applications
There are a lot of Intel
EP3SL200H780C3 FPGAs applications.
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
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