INTEL EP3SE50F484C2NES
Manufacturer No:
EP3SE50F484C2NES
Manufacturer:
INTEL
Package:
Description:
FPGAs
Quantity:
In Stock :1167
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Expected Shipping：Wed, Jun 3 - Thu, Jun 4, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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EP3SE50F484C2NES Information
INTEL EP3SE50F484C2NES technical specifications, attributes, parameters and parts with similar specifications to INTEL EP3SE50F484C2NES.
- Type
- Parameter
- Mount
- Surface Mount
- Published
- 2006
- Max Operating Temperature
- 85°C
- Min Operating Temperature
- 0°C
- Number of I/O
- 296
- RAM Size
- 703.1kB
- Number of Logic Elements/Cells
- 47500
- Number of Logic Blocks (LABs)
- 1900
- RoHS Status
- RoHS Compliant
- Type
- Parameter
Download datasheets and manufacturer documentation for INTEL EP3SE50F484C2NES.
EP3SE50F484C2NES Overview
A total of 296 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 47500 logic elements/cells. The RAM si703.1kBe of this FPGA module reaches 703.1kB so as to guarantee the normal operation of the program during operation. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. This module can reach a maximum operating temperature of 85°C when operating at its maximum power. Fpga electronics is necessary to maintain an operating temperature higher than 0°C. 1900 logic blocks (LABs) constitute its basic building block.
EP3SE50F484C2NES Features
296 I/Os
85°C gates
1900 logic blocks (LABs)
EP3SE50F484C2NES Applications
There are a lot of Altera
EP3SE50F484C2NES FPGAs applications.
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics
- Distributed Monetary Systems
- Data Center
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12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
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