INTEL EP3C40F484C8
INTEL EP3C40F484C8

INTEL EP3C40F484C8

Manufacturer No:

EP3C40F484C8

Manufacturer:

INTEL

Package:

484-BGA

Description:

FPGAs Cyclone® III Series 484-BGA 1 mm mm

User Guide

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PURCHASE

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RFQ (REQUEST FOR QUOTATIONS)

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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

EP3C40F484C8 Information

INTEL EP3C40F484C8 technical specifications, attributes, parameters and parts with similar specifications to INTEL EP3C40F484C8.

  • Type
  • Parameter
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 484-BGA
  • Surface Mount
  • YES
  • Supplier Device Package
  • 484-FBGA (23x23)
  • Number of Terminals
  • 484
  • Package Description
  • BGA, BGA484,22X22,40
  • Package Style
  • GRID ARRAY
  • Moisture Sensitivity Level
  • 3
  • Package Body Material
  • PLASTIC/EPOXY
  • Package Equivalence Code
  • BGA484,22X22,40
  • Type
  • Parameter
  • Supply Voltage-Nom
  • 1.2 V
  • Reflow Temperature-Max (s)
  • 30
  • Supply Voltage-Min
  • 1.15 V
  • Operating Temperature-Max
  • 85 °C
  • RoHS Status
  • Non-RoHS Compliant
  • Manufacturer Part Number
  • EP3C40F484C8
  • Clock Frequency-Max
  • 472.5 MHz
  • Package Code
  • BGA
  • Package Shape
  • SQUARE
  • Manufacturer
  • Intel Corporation

Download datasheets and manufacturer documentation for INTEL EP3C40F484C8.

EP3C40F484C8 Overview


In the package 484-BGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 331 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 39600 logic elements/cells. There is a Field Programmable Gate Arrays family component in this FPGA part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.15 V ~ 1.25 V, this device operates with ease. This is a type of FPGA that is part of the Cyclone® III series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C ~ 85°C (TJ) when the device is operating. In this device, 331 outputs are incorporated in order to provide you with maximum flexibility. Fpga electronics is worth mentioning that this device provides 1161216 bfpga electronics s of RAM. EP3C40 is the base part number that can be used to identify related parts. The FPGA is built as an array of 2475 latches or CLBs. The architecture of the system is based on 39600 CLBs. It incorporates 39600 logic cells used for the building block. As a supplier, 484-FBGA (23x23) is responsible for the package of its devices. During the configuration of the system, 484 terminals are used.

EP3C40F484C8 Features


331 I/Os
Up to 1161216 RAM bits


EP3C40F484C8 Applications


There are a lot of ALTERA
EP3C40F484C8 FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center

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Shipped from:HK Warehouse
Expected Shipping:Thu, Mar 26 - Fri, Mar 27, 2026
Date Code:Within 2 Years

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