INTEL EP3C25F324C7N
Manufacturer No:
EP3C25F324C7N
Manufacturer:
INTEL
Package:
324-BGA
Description:
FPGAs Cyclone® III Series 324-BGA 1 mm mm
Quantity:
In Stock :8617
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Shipping & Availability
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Shipped from：HK Warehouse
Expected Shipping：Sun, Jun 7 - Mon, Jun 8, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
EP3C25F324C7N Information
INTEL EP3C25F324C7N technical specifications, attributes, parameters and parts with similar specifications to INTEL EP3C25F324C7N.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- 324-BGA
- Surface Mount
- YES
- Supplier Device Package
- 324-FBGA (19x19)
- Number of Terminals
- 324
- Package Description
- BGA, BGA324,18X18,40
- Package Style
- GRID ARRAY
- Moisture Sensitivity Level
- 3
- Package Body Material
- PLASTIC/EPOXY
- Package Equivalence Code
- BGA324,18X18,40
- Type
- Parameter
- Supply Voltage-Nom
- 1.2 V
- Reflow Temperature-Max (s)
- 40
- Supply Voltage-Min
- 1.15 V
- Operating Temperature-Max
- 85 °C
- RoHS Status
- RoHS Compliant
- Manufacturer Part Number
- EP3C25F324C7N
- Clock Frequency-Max
- 472.5 MHz
- Package Code
- BGA
- Package Shape
- RECTANGULAR
- Manufacturer
- Intel Corporation
Download datasheets and manufacturer documentation for INTEL EP3C25F324C7N.
EP3C25F324C7N Overview
In the package 324-BGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 215 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 24624 logic elements/cells. There is a Field Programmable Gate Arrays family component in this FPGA part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.15 V ~ 1.25 V, this device operates with ease. This is a type of FPGA that is part of the Cyclone® III series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C ~ 85°C (TJ) when the device is operating. In this device, 215 outputs are incorporated in order to provide you with maximum flexibility. Fpga electronics is worth mentioning that this device provides 608256 bfpga electronics s of RAM. EP3C25 is the base part number that can be used to identify related parts. The FPGA is built as an array of 1539 latches or CLBs. The architecture of the system is based on 24624 CLBs. It incorporates 24624 logic cells used for the building block. As a supplier, 324-FBGA (19x19) is responsible for the package of its devices. During the configuration of the system, 324 terminals are used.
EP3C25F324C7N Features
215 I/Os
Up to 608256 RAM bits
EP3C25F324C7N Applications
There are a lot of ALTERA
EP3C25F324C7N FPGAs applications.
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics
- Distributed Monetary Systems
- Data Center
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
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