

INTEL EP3C25F324C7
Manufacturer No:
EP3C25F324C7
Manufacturer:
Package:
324-BGA
Description:
FPGAs Cyclone® III Series 324-BGA 1 mm mm
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EP3C25F324C7 information
INTEL EP3C25F324C7 technical specifications, attributes, parameters and parts with similar specifications to INTEL EP3C25F324C7.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- 324-BGA
- Surface Mount
- YES
- Supplier Device Package
- 324-FBGA (19x19)
- Number of Terminals
- 324
- Package Description
- BGA, BGA324,18X18,40
- Package Style
- GRID ARRAY
- Moisture Sensitivity Level
- 3
- Package Body Material
- PLASTIC/EPOXY
- Package Equivalence Code
- BGA324,18X18,40
- Supply Voltage-Nom
- 1.2 V
- Reflow Temperature-Max (s)
- 30
- Supply Voltage-Min
- 1.15 V
- Operating Temperature-Max
- 85 °C
- RoHS Status
- Non-RoHS Compliant
- Manufacturer Part Number
- EP3C25F324C7
- Clock Frequency-Max
- 472.5 MHz
- Package Code
- BGA
- Package Shape
- SQUARE
- Manufacturer
- Intel Corporation
- Part Life Cycle Code
- Active
- Ihs Manufacturer
- INTEL CORP
- Supply Voltage-Max
- 1.25 V
- Risk Rank
- 5.22
- Series
- Cyclone® III
- JESD-609 Code
- e0
- Part Status
- Active
- ECCN Code
- 3A991
- Terminal Finish
- TIN LEAD
- HTS Code
- 8542.39.00.01
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
- Voltage - Supply
- 1.15 V ~ 1.25 V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 220
- Terminal Pitch
- 1 mm
- Reach Compliance Code
- compliant
- Base Part Number
- EP3C25
- JESD-30 Code
- S-PBGA-B324
- Number of Outputs
- 215
- Qualification Status
- Not Qualified
- Temperature Grade
- OTHER
- Number of I/O
- 215
- Number of Inputs
- 215
- Organization
- 24624 CLBS
- Seated Height-Max
- 1.9 mm
Download datasheets and manufacturer documentation for INTEL EP3C25F324C7.
EP3C25F324C7 Overview
In the 324-BGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 215 I/O ports for more coherent data transfer. To form a fundamental building block, there are 24624 logic elements/cells. FPGA parts like this belong to the Field Programmable Gate Arrays family. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 1.15 V ~ 1.25 V-volt supply voltage required for the device to operate. The Cyclone® III Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within 0°C ~ 85°C (TJ) when operating. A total of 215 outputs are incorporated into this device. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 608256 bFpga chipss. You can find related parts by using the part number EP3C25, which is its base part number. A total of 1539 LABs/CLBs are included in this FPGA. For its architecture, 24624 CLB modules are used. During the construction of the building block, there are 24624 logic cells used. Its supplier package is called 324-FBGA (19x19). Fpga circuit can be configured using 324 terminals, each of which has fpga circuits own functions.
EP3C25F324C7 Features
215 I/Os
Up to 608256 RAM bits
EP3C25F324C7 Applications
There are a lot of ALTERA
EP3C25F324C7 FPGAs applications.
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
User Guide
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Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

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