INTEL EP3C25F256C7N
Manufacturer No:
EP3C25F256C7N
Manufacturer:
INTEL
Package:
256-LBGA
Description:
FPGAs Cyclone® III Series 256-LBGA 1 mm mm
Quantity:
In Stock :1106
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Shipped from：HK Warehouse
Expected Shipping：Sun, Jun 7 - Mon, Jun 8, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Step2：Desiccant Protection
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Step4：Individual Package
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Step6：Packaging Box
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2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
EP3C25F256C7N Information
INTEL EP3C25F256C7N technical specifications, attributes, parameters and parts with similar specifications to INTEL EP3C25F256C7N.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- 256-LBGA
- Surface Mount
- YES
- Supplier Device Package
- 256-FBGA (17x17)
- Number of Terminals
- 256
- Package Description
- LBGA, BGA256,16X16,40
- Package Style
- GRID ARRAY, LOW PROFILE
- Moisture Sensitivity Level
- 3
- Package Body Material
- PLASTIC/EPOXY
- Package Equivalence Code
- BGA256,16X16,40
- Type
- Parameter
- Supply Voltage-Nom
- 1.2 V
- Reflow Temperature-Max (s)
- 40
- Supply Voltage-Min
- 1.15 V
- Operating Temperature-Max
- 85 °C
- RoHS Status
- RoHS Compliant
- Manufacturer Part Number
- EP3C25F256C7N
- Clock Frequency-Max
- 472.5 MHz
- Package Code
- LBGA
- Package Shape
- RECTANGULAR
- Manufacturer
- Intel Corporation
Download datasheets and manufacturer documentation for INTEL EP3C25F256C7N.
Product Description:
The EP3C25F256C7N is a high-performance, low-power Field Programmable Gate Array (FPGA) from Altera, now part of Intel Corporation. This device is part of the Cyclone III series, designed for a wide range of applications requiring high-speed logic and signal processing.
Features:
- 156 I/O pins
- Operating temperature range of 0°C to 85°C
- Supply voltage range of 1.15V to 1.25V
- 256-ball, 17x17mm FBGA package
- 1539 Logic Array Blocks (LABs) and 24624 Logic Cells
- 608256 total RAM bits
- Clock frequency up to 472.5 MHz
- RoHS compliant and lead-free
Applications:
- High-speed data acquisition and processing
- Industrial control and automation
- Medical imaging and diagnostics
- Aerospace and defense systems
- Automotive infotainment and safety systems
Alternative Parts:
- EP3C25F256C7N is a direct replacement for the EP3C25F256C7N-2F
- EP3C25F256C7N is also compatible with other Cyclone III devices, such as the EP3C25F256C7N-2F
Embedded Modules:
- The EP3C25F256C7N is used in various embedded systems, including:
- Industrial control systems
- Medical imaging devices
- Automotive infotainment systems
FAQs:
Q: What is the maximum operating temperature of the EP3C25F256C7N? A: The maximum operating temperature is 85°C.
Q: What is the supply voltage range of the EP3C25F256C7N? A: The supply voltage range is 1.15V to 1.25V.
Q: Is the EP3C25F256C7N RoHS compliant? A: Yes, the EP3C25F256C7N is RoHS compliant and lead-free.
Q: What is the package type of the EP3C25F256C7N? A: The package type is 256-ball, 17x17mm FBGA.
Q: What is the clock frequency of the EP3C25F256C7N? A: The clock frequency is up to 472.5 MHz.
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