INTEL EP3C10F256C7N
INTEL EP3C10F256C7N

INTEL EP3C10F256C7N

Manufacturer No:

EP3C10F256C7N

Manufacturer:

INTEL

Package:

256-LBGA

Description:

1.2 V V 51.8 kB B FPGAs Cyclone® III Series 437.5 MHz MHz 256-LBGA 1 mm mm

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Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

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3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

EP3C10F256C7N Information

INTEL EP3C10F256C7N technical specifications, attributes, parameters and parts with similar specifications to INTEL EP3C10F256C7N.

  • Type
  • Parameter
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 256-LBGA
  • Surface Mount
  • YES
  • Number of Pins
  • 256
  • Supplier Device Package
  • 256-FBGA (17x17)
  • Number of Terminals
  • 256
  • Number of Macrocells
  • 10320
  • Number of I/Os
  • 182
  • RoHS Status
  • RoHS Compliant
  • Type
  • Parameter
  • Package Description
  • LBGA, BGA256,16X16,40
  • Package Style
  • GRID ARRAY, LOW PROFILE
  • Moisture Sensitivity Level
  • 3
  • Package Body Material
  • PLASTIC/EPOXY
  • Package Equivalence Code
  • BGA256,16X16,40
  • Supply Voltage-Nom
  • 1.2 V
  • Reflow Temperature-Max (s)
  • 30
  • Supply Voltage-Min
  • 1.15 V
  • Operating Temperature-Max
  • 85 °C
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for INTEL EP3C10F256C7N.

Product Description:

The EP3C10F256C7N is a high-performance, lead-free, and RoHS-compliant Field Programmable Gate Array (FPGA) from Altera (now Intel Corporation). This device is part of the Cyclone III series and is designed for a wide range of applications, including digital signal processing, data conversion, and communication systems.

Features:

  • 182 I/O pins
  • 645 Logic Blocks (LABs) and 10320 Logic Cells (CLBs)
  • 51.8 kB of RAM
  • Operating temperature range of 0°C to 85°C
  • Supply voltage range of 1.15V to 1.25V
  • Maximum frequency of 315 MHz
  • Surface-mount package with a 256-pin BGA (Ball Grid Array) package

Applications:

  • Digital signal processing
  • Data conversion
  • Communication systems
  • Industrial control systems
  • Automotive systems

Alternative Parts:

  • EP3C10 (base part number)
  • Other Cyclone III series FPGAs from Altera (now Intel Corporation)

Embedded Modules:

  • This component is used in various embedded systems, including:
    • Digital signal processing modules
    • Data conversion modules
    • Communication modules

Frequently Asked Questions (FAQs):

Q: What is the operating temperature range of the EP3C10F256C7N? A: The operating temperature range is 0°C to 85°C.

Q: What is the supply voltage range of the EP3C10F256C7N? A: The supply voltage range is 1.15V to 1.25V.

Q: What is the maximum frequency of the EP3C10F256C7N? A: The maximum frequency is 315 MHz.

Q: Is the EP3C10F256C7N lead-free and RoHS-compliant? A: Yes, the EP3C10F256C7N is lead-free and RoHS-compliant.

Q: What is the package type of the EP3C10F256C7N? A: The package type is a 256-pin BGA (Ball Grid Array) package.

Q: What is the technology used in the EP3C10F256C7N? A: The technology used is CMOS.

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Expected Shipping:Thu, Apr 9 - Fri, Apr 10, 2026
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