

INTEL EP2C50F672C8N
Manufacturer No:
EP2C50F672C8N
Manufacturer:
Package:
672-BGA
Description:
FPGAs Cyclone® II Series 672-BGA 1 mm mm
Quantity:
Delivery:




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In Stock :Available
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EP2C50F672C8N information
INTEL EP2C50F672C8N technical specifications, attributes, parameters and parts with similar specifications to INTEL EP2C50F672C8N.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- 672-BGA
- Surface Mount
- YES
- Supplier Device Package
- 672-FBGA (27x27)
- Number of Terminals
- 672
- Package Description
- LEAD FREE, FBGA-672
- Package Style
- GRID ARRAY
- Moisture Sensitivity Level
- 3
- Package Body Material
- PLASTIC/EPOXY
- Package Equivalence Code
- BGA672,26X26,40
- Supply Voltage-Nom
- 1.2 V
- Reflow Temperature-Max (s)
- 40
- Supply Voltage-Min
- 1.15 V
- Operating Temperature-Max
- 85 °C
- RoHS Status
- RoHS Compliant
- Manufacturer Part Number
- EP2C50F672C8N
- Clock Frequency-Max
- 402.5 MHz
- Package Code
- BGA
- Package Shape
- SQUARE
- Manufacturer
- Altera Corporation
- Part Life Cycle Code
- Transferred
- Ihs Manufacturer
- ALTERA CORP
- Supply Voltage-Max
- 1.25 V
- Risk Rank
- 3.57
- Operating Temperature
- 0°C ~ 85°C (TJ)
- Series
- Cyclone® II
- JESD-609 Code
- e1
- Pbfree Code
- Yes
- Part Status
- Active
- ECCN Code
- 3A991
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- Additional Feature
- ALSO REQUIRES 3.3 SUPPLY
- HTS Code
- 8542.39.00.01
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
- Voltage - Supply
- 1.15 V ~ 1.25 V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 260
- Terminal Pitch
- 1 mm
- Reach Compliance Code
- unknown
- Base Part Number
- EP2C50
- Pin Count
- 672
- JESD-30 Code
- S-PBGA-B672
- Number of Outputs
- 434
- Qualification Status
- Not Qualified
- Power Supplies
- 1.2,1.5/3.3,3.3 V
Download datasheets and manufacturer documentation for INTEL EP2C50F672C8N.
EP2C50F672C8N Overview
Fpga chips is supplied in the 672-BGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 450 I/Os for transferring data in a more coherent manner. There are 50528 logic elements/cells to form a fundamental building block. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.15 V ~ 1.25 V. It is a type of FPGA belonging to the Cyclone® II seies. The operating temperature should be kept at 0°C ~ 85°C (TJ) when operating. There are 434 outputs incorporated in this device. The RAM bits that this device offer is 594432. Its base part number EP2C50 can be used to find related parts. This FPGA is built as an array of 3158 LABs/CLBs. Fpga electronics operates from a 1.2,1.5/3.3,3.3 V power supply. Fpga semiconductor is equipped wfpga semiconductorh 672 pin count. 3158 CLBs are basic modules used for its architecture. Fpga semiconductor incorporates 50528 logic cells used for the building block. It employs 672-FBGA (27x27) as its supplier device package. Fpga semiconductor is also characteriALSO REQUIRES 3.3 SUPPLYed by a feature called ALSO REQUIRES 3.3 SUPPLY. There are 672 terminals used for its configuration.
EP2C50F672C8N Features
450 I/Os
Up to 594432 RAM bits
EP2C50F672C8N Applications
There are a lot of ALTERA
EP2C50F672C8N FPGAs applications.
- Digital signal processing
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
User Guide
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