INTEL EP2C50F672C8
INTEL EP2C50F672C8

INTEL EP2C50F672C8

Manufacturer No:

EP2C50F672C8

Manufacturer:

INTEL

Package:

208-BFQFP

Description:

9Mb (256K x 36) B FPGAs -- Series 208-BFQFP 1 mm mm

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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EP2C50F672C8 information

INTEL EP2C50F672C8 technical specifications, attributes, parameters and parts with similar specifications to INTEL EP2C50F672C8.

  • Type
  • Parameter
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 208-BFQFP
  • Surface Mount
  • YES
  • Supplier Device Package
  • 208-PQFP (28x28)
  • Number of Terminals
  • 672
  • Package Description
  • BGA, BGA672,26X26,40
  • Package Style
  • GRID ARRAY
  • Moisture Sensitivity Level
  • 3
  • Package Body Material
  • PLASTIC/EPOXY
  • Package Equivalence Code
  • BGA672,26X26,40
  • Supply Voltage-Nom
  • 1.2 V
  • Reflow Temperature-Max (s)
  • 30
  • Supply Voltage-Min
  • 1.15 V
  • Operating Temperature-Max
  • 85 °C
  • RoHS Status
  • Non-RoHS Compliant
  • Manufacturer Part Number
  • EP2C50F672C8
  • Clock Frequency-Max
  • 402.5 MHz
  • Package Code
  • BGA
  • Package Shape
  • SQUARE
  • Manufacturer
  • Intel Corporation
  • Part Life Cycle Code
  • Active
  • Ihs Manufacturer
  • INTEL CORP
  • Supply Voltage-Max
  • 1.25 V
  • Risk Rank
  • 5.23
  • Packaging
  • Tray
  • JESD-609 Code
  • e0
  • Part Status
  • Obsolete
  • ECCN Code
  • 3A991
  • Terminal Finish
  • TIN LEAD
  • Additional Feature
  • ALSO REQUIRES 3.3 SUPPLY
  • HTS Code
  • 8542.39.00.01
  • Subcategory
  • Field Programmable Gate Arrays
  • Technology
  • SRAM - Dual Port, Synchronous
  • Voltage - Supply
  • 2.4 V ~ 2.6 V
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 220
  • Terminal Pitch
  • 1 mm
  • Reach Compliance Code
  • compliant
  • Base Part Number
  • IDT70T3519
  • JESD-30 Code
  • S-PBGA-B672
  • Number of Outputs
  • 434
  • Qualification Status
  • Not Qualified
  • Power Supplies
  • 1.2,1.5/3.3,3.3 V
  • Temperature Grade
  • OTHER
  • Memory Size
  • 9Mb (256K x 36)
  • Number of I/O
  • 450

Download datasheets and manufacturer documentation for INTEL EP2C50F672C8.

EP2C50F672C8 Overview


There is a 208-BFQFP package that includes this component. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. 450 I/Os are available for transferring data more efficiently. A fundamental building block consists of 50528 logic elements/cells. Field Programmable Gate Arrays family FPGA part. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 2.4 V ~ 2.6 V is needed in order for fpga chips to operate. As part of the -- series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of -40°C ~ 85°C (TA). The device has 434 outputs that are integrated into it. As a space-saving measure, this FPGA model is contained within Tray. There are 594432 RAM bits that are available with this device. In order to find related parts, you can use its base part number IDT70T3519. 3158 LABs and CLBs are built into this FPGA. Power is provided by a 1.2,1.5/3.3,3.3 V battery that is included with the device. Usually, fpga semiconductor uses a 133MHz crystal. Programs and data can be stored in the 9Mb (256K x 36) memory embedded in this FPGA module. There are 3158 CLBs that make up the architecture of the system. For the building block, it incorporates 50528 logic cells that are used to make it work. There is a device package provided by 208-PQFP (28x28) as its supplier. Additionally, this feature is also known as ALSO REQUIRES 3.3 SUPPLY, which is one of its main characteristics. Data is stored in the Volatile memory, so resource conflicts are avoided. A total of 672 terminals are used for configuring the system.

EP2C50F672C8 Features


450 I/Os
Up to 594432 RAM bits


EP2C50F672C8 Applications


There are a lot of ALTERA
EP2C50F672C8 FPGAs applications.


  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding

User Guide

PURCHASE

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MEANS OF PAYMENT

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RFQ (REQUEST FOR QUOTATIONS)

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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.