Rochester EP2A70F1508C9
Manufacturer No:
EP2A70F1508C9
Manufacturer:
Rochester
Package:
1508-BBGA, FCBGA
Description:
3.5mm mm FPGAs APEX II Series 1508-BBGA, FCBGA 1mm mm
Quantity:
In Stock :1486
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Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Fri, May 29 - Sat, May 30, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
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Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
EP2A70F1508C9 Information
Rochester EP2A70F1508C9 technical specifications, attributes, parameters and parts with similar specifications to Rochester EP2A70F1508C9.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- 1508-BBGA, FCBGA
- Surface Mount
- YES
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- APEX II
- JESD-609 Code
- e0
- Pbfree Code
- no
- Part Status
- Obsolete
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Type
- Parameter
- Terminal Finish
- TIN LEAD
- Technology
- CMOS
- Voltage - Supply
- 1.425V~1.575V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 245
- Supply Voltage
- 1.5V
- Terminal Pitch
- 1mm
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- JESD-30 Code
- S-PBGA-B1508
Download datasheets and manufacturer documentation for Rochester EP2A70F1508C9.
EP2A70F1508C9 Overview
A 1508-BBGA, FCBGA package contains it, and it is available for download. There are LOADABLE PLD transistors in this type of FPGA. Its 1060 I/Os help it transfer data more efficiently. A fundamental building block contains 67200 logic elements or cells. Power is provided by a 1.5V-volt supply. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 1.425V~1.575V and uses a battery to supply power. FPGAs belonging to the APEX II series are a type of FPGA that belong to the APEX II series of FPGAs. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. A model of this FPGA is contained in Tray for the purpose of saving space. Having a RAM bit size of 1146880 means that this device will offer you a lot of memory. 6720 LABs/CLBs are integrated into this FPGA. 5250000 gates make up the basic block of its construction.
EP2A70F1508C9 Features
1060 I/Os
Up to 1146880 RAM bits
EP2A70F1508C9 Applications
There are a lot of Rochester Electronics, LLC
EP2A70F1508C9 FPGAs applications.
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics
- Distributed Monetary Systems
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
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