Microchip DSPIC33AK256MC505-I/M7

200MHz, 32-bit dsPIC33A Digital Signal Controller (DSC) with 32/64bit Floating-Point Unit (FPU) and up to 512KB Flash Program Memory and 64KB SRAM Data Memory. High-speed 40MSPS 12-bit ADCs, high-bandwidth 100MHz op amps with low input voltage offset, fast 5nS comparators and high-speed PWM outputs designed to optimize real-time control applications. Designed as per ISO 26262 and IEC 61508 Functional Safety Compliance, the family offers on-chip security features and AEC-Q100 qualification support.

Operating Conditions
• 3.0V to 3.6V: -40°C to +85°C, DC to 200 MHz
• 3.0V to 3.6V: -40°C to +125°C, DC to 200 MHz
• 3.0V to 3.6V: -40°C to +150°C, DC to 100 MHz

High-Performance dsPIC33A Digital Signal Controller (DSC)
• 32-bit Rich Instruction Set for Optimized Speed and Program Code Size
• Non-paged linear Data/Flash 24-bit addressing space
• 16-bit/32-bit instructions for optimized code size and performance
• 32-bit Wide Data Paths
• Single and Double Precision Floating-Point Unit (FPU) Coprocessor
• Edge or Level Change Notification Interrupt on I/O pins
• Peripheral Pin Select (PPS) Remappable Pins to Reduce Board Layout Complexity
• Multiple Interrupt Vectors with Individual Programmable Priority
• Five External Interrupt Pins
• Selectable Oscillator Options Including:
• 8 MHz, 1% at 0ºC-85ºC Internal Fast RC (FRC) oscillator
• 8 MHz, 2% Internal Backup Fast RC (BFRC) oscillator with 32 kHz divided output
• 2 Kbyte Instruction Cache
• Sixteen 32-bit Working Registers
• Dual 72-bit Accumulators Supporting 32-bit and 16-bit Fixed-Point DSP Operations
• Eight Level Deep Working Register Sets
• Eight Level Deep Accumulator Register Sets
• Eight Level Deep Floating Point Register Sets

Memory Features
• Up to 512 Kbytes of Program Flash Memory:
• 10,000 erase/write cycle endurance
• 20 years minimum data retention
• Self-programmable under software control
• Programmable code protection
• Flash Error Correcting Code (ECC)
• Programmable OTP regions
• Entire Flash OTP by ICSP™ write inhibit
• High-speed crystal resonator oscillator or external clock
• Up to 64 Kbytes of RAM Memory:
• 8-channel hardware Direct Memory Access (DMA) module
• RAM Error Correcting Code (ECC)
• RAM Memory Built-In Self-Test (MBIST)
• Flash Built-In Self-Test (NVMBIST)

High-Speed PWM
• Multiple PWM Generators:
• Twelve pair (twenty four output) generators with resolution down to 1.25 ns
• Dead-Time Compensation Supports Lower Speed Operation
• PWM Support for:
• BLDC, PMSM, ACIM, SRM and stepper motors
• Constant on-time, hysteretic, burst mode power applications
• Fault and Current Limit Inputs
• Flexible Trigger Configuration for ADC Triggering

High-Speed Analog-to-Digital Converters
• Five 12-bit Resolution ADCs
• Up to 40 MSPS Conversion Rate
• Up to 26 Analog Input Pins
• Sixteen Settings Channels. Each Channel:
• Can be assigned to any analog input (I/O pin or internal signal)
• Can be set to a different sampling time
• Can be configured as single-ended or differential
• Conversion result can be formatted as unsigned or signed
• Conversion result can be left-aligned (fraction format)
• Has a separate 32-bit conversion result register
• Supports Four Sampling modes:
• Oversampling of multiple samples
• Integration of multiple samples
• Window (multiple samples accumulated when the gate signal is active)
• Single Conversion
• All channels have a digital comparator to detect when the conversion result is less than, greater than, in bounds or out of bounds for the configurable thresholds
• Last three settings channels have the second result accumulator to implement second order filters
• Band Gap Reference and Temperature Sensor Diode Inputs

Other Analog Features
• Eight 5 nS Analog Comparators with 12-bit PDM DACs
• Input multiplexing
• Slope compensation
• Up to two DAC output buffers
• Four Constant-Current Sources
• 3 Rail-to-Rail 100 MHz Operational Amplifiers with 40 V/μS slew rate
• 1 mV offset (typical) with calibration of input offset voltage
• Integrated Touch Controller:
• Independent from ADC processing capability
• Self and Mutual CVD Touch Modes support
• 18 TO 32 Touch ADC RX inputs
• 8 TO 32 Touch TX outputs
• Advanced capacitive sensing, touch buttons, sliders and wheels
• Up to 32 self-capacitance channels and up to 256 mutual-capacitance channels

Peripheral Features
• Four 4-Wire SPI Modules:
• 32-byte FIFO
• Variable data width
• I2S mode
• Three I2C Modules w/Address Masking and IPMI Support
• Three Protocol UARTs with 8-bit RX/TX FIFOs and Automated Handling Support for:
• LIN 2.2
• DMX
• Smart card (ISO 7816)
• IrDA®
• Two SENT Modules
• Three Dedicated 32-bit Timer/Counter
• Single (SCCP) and Multiple (MCCP) Output Capture/Compare/PWM/Timer Modules:
• One MCCP Module
• Eight SCCP Modules
• Flexible configuration as PWM, input capture, output compare or timers
• Two 16-bit timers or one 32-bit timer in each module
• Single PWM output pin
• Four Quadrature Encoder Interface (QEI):
• Four inputs: Phase A, Phase B, Home, Index
• Ten Configurable Logic Cells (CLC) with Internal Connections to Select Peripherals and PPS
• Serial Encoder Interface BiSS with up to Four Client Encoders Support
• Peripheral Trigger Generator (PTG):
• 14 input trigger sources from other peripheral modules
• 5 output triggers to other peripheral modules
• 4 individual interrupt request signals
• CPU independent state machine-based instruction sequencer

Security Module
• Flash OTP by ICSP Write Inhibit
• On-chip Secure Boot Flash Configurable as an Immutable Root-of-Trust
• Secure Boot Support: Validation of Host Code Image and Host Code Signature Validation
• Secure Update Support for Host Code: Secure Encryption Key Storage and Image Decryption
• X.509 Certification Storage, Parsing, Validation and Revocation, Supporting both ECC and RSA
• 128-bit Unique Device Serial Number for Identification (UUID)
• Support for Secure Use Cases:
• Secure Boot
• Secure FW upgrade
• Secure debug
• Device locking
• Key Storage in IRT/ Immutable secure boot region for realizing: secure boot, secure firmware update, secure debug
• Flash protection:
• Configuration of up to 8 Flash protection regions across ranges of Flash addresses
• Regions can be configured as: Immutable Root-of-Trust (IRT), OTP region, combination of R/W/X protections.
• Regions can be: Made permanent, locked until device reset, enabled/disabled during code execution

Safety Features
• Windowed Watchdog Timer (WDT)
• Deadman Timer (DMT)
• Sixteen I/O Integrity Monitors (IOIM)
• Fail-Safe Clock Monitor (FSCM) with Automatic Switchover to Backup Clock Source with:
• Programmable over-frequency/under-frequency thresholds
• Flash Error Correcting Code (ECC)
• RAM Error Correcting Code (ECC)
• RAM Memory Built-In Self-Test (MBIST)
• 32-bit Cyclic Redundancy Check (CRC) Module
• Entire Flash OTP by ICSP™ Write Inhibit
• Capless Internal Voltage Regulator
• Virtual PPS Pins for Redundancy and Monitoring
• Temperature Sensor Diode

Functional Safety
• ISO 26262 and IEC 61508 Compliant Device Development
• Functional Safety Support – ISO 26262/IEC 61508/IEC 60730. To learn about the Functional Safety Support of this device family and various Functional Safety standards an application can target using this device family

Qualification
• AEC-Q100 REV H: Grade 1: -40°C to +125°C
• AEC-Q100 REV H: Grade 0: -40°C to +150°C

Programming and Debug Interfaces
• Three Programming and Debugging Interfaces:
• Two-wire ICSP™ interface with non-intrusive access and real-time data exchange with application
• Five Program Addresses and Five Full-Featured Breakpoints
• IEEE Standard 1149.2 Compatible (JTAG) Boundary Scan