Texas Instruments DRV8351DIMPWTSEP
Manufacturer No:
DRV8351DIMPWTSEP
Manufacturer:
Texas Instruments
Package:
Description:
Radiation-tolerant, 40V simple 3-phase gate driver with bootstrap diodes
Quantity:
In Stock :4003
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Expected Shipping：Fri, May 29 - Sat, May 30, 2026
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Date Code：Within 2 Years
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DRV8351DIMPWTSEP Information
Texas Instruments DRV8351DIMPWTSEP technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments DRV8351DIMPWTSEP.
- Type
- Parameter
- Rating
- Space
- Architecture
- Gate driver
- Vs (min) (V)
- 5
- Vs ABS (max) (V)
- 57.5
- Operating temperature range (°C)
- -55 to 125
- Package
- TSSOP (PW)
- Pins
- 20
- Size
- 41.6 mm² 6.5 x 6.4
- REACH Status
- Yes
- RoHS Status
- RoHS Compliant
- Type
- Parameter
Download datasheets and manufacturer documentation for Texas Instruments DRV8351DIMPWTSEP.
Radiation & reliability report:
Data sheet:
DRV8351-SEP is a three phase half-bridge gate driver, capable of driving high-side and low-side N-channel power MOSFETs. The DRV8351-SEPD generates the correct gate drive voltages using an integrated bootstrap diode and external capacitor for the high-side MOSFETs. GVDD is used to generate gate drive voltage for the low-side MOSFETs. The Gate Drive architecture supports peak up to 750mA source and 1.5A sink currents.
The phase pins SHx are able to tolerate significant negative voltage transients; while high side gate driver supply BSTx and GHx can support higher positive voltage transients (57.5V) abs max voltage which improve the robustness of the system. Small propagation delay and delay matching specifications minimize the dead-time requirement which further improves efficiency. Undervoltage protection is provided for both low and high sides through GVDD and BST undervoltage lockout.
- 40V Three Phase Half-Bridge Gate driver
- Drives N-Channel MOSFETs (NMOS)
- Gate Driver Supply (GVDD): 5-15V
- MOSFET supply (SHx) supports up to 40V
- Radiation Performance
- SEL, SEB, and SET resistant up to LET = 43 MeV-cm2 /mg
- SET and SEFI characterized up to LET = 43 MeV-cm2 /mg
- TID assured for every wafer lot up to 30 krad(Si)
- TID characterized up to 30 krad(Si)
- Cross conduction event is observed during SEE and SEB. Refer to SEE report for more details.
- Space-enhanced plastic (space EP):
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication site
- Extended Product Life Cycle
- Product Traceability
- Integrated Bootstrap Diodes
- Supports Inverting and Non-Inverting INLx inputs
- Bootstrap gate drive architecture
- 750mA source current
- 1.5- sink current
- Low leakage current on SHx pins (<55µA)
- Absolute maximum BSTx voltage up to 57.5V
- Supports negative transients up to -22V on SHx
- Fixed deadtime insertion of 200nS
- Supports 3.3V and 5V logic inputs with 20V Abs max
- 4nS typical propagation delay matching
- Compact TSSOP package
- Efficient system design with Power Blocks
- Integrated protection features
- BST undervoltage lockout (BSTUV)
- GVDD undervoltage (GVDDUV)
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