Texas Instruments CSD95379Q3MG4
Texas Instruments CSD95379Q3MG4

Texas Instruments CSD95379Q3MG4

Manufacturer No:

CSD95379Q3MG4

Manufacturer:

Texas Instruments

Package:

Description:

Synchronous Buck NexFET Power Stage, CSD95379Q3M

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In Stock :5146

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Shipped from:HK Warehouse
Expected Shipping:Sat, May 9 - Sun, May 10, 2026
Date Code:Within 2 Years

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Step1:Prepare product

Step1:Prepare product

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Step2:Desiccant Protection

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Step3:Vacuum Packaging

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Step4:Individual Package

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SHIPPING METHOD

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DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

CSD95379Q3MG4 Information

Texas Instruments CSD95379Q3MG4 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments CSD95379Q3MG4.

  • Type
  • Parameter
  • VDS (V)
  • 20
  • Ploss current (A)
  • 12
  • Rating
  • Catalog
  • Operating temperature range (°C)
  • -40 to 150
  • Package
  • VSON-CLIP (DNS)
  • Pins
  • 10
  • Size
  • 10.89 mm² 3.3 x 3.3
  • REACH Status
  • Affected
  • RoHS Status
  • Type
  • Parameter

Download datasheets and manufacturer documentation for Texas Instruments CSD95379Q3MG4.

The CSD95379Q3M NexFET™ power stage is a highly optimized design for use in high-power, high-density synchronous buck converters. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces high-current, high-efficiency, and high-speed switching capability in a small 3.3-mm × 3.3-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

  • 92.5% System Efficiency at 12 A
  • Ultra-Low Power Loss of 1.8 W at 12 A
  • Max Rated Continuous Current of 20 A and Peak Current of 45 A
  • High-Frequency Operation (up to 2 MHz)
  • High-Density SON 3.3-mm × 3.3-mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Low Quiescent (LQ) and Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3-V and 5-V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free