Texas Instruments CC2745P10E0WRHARQ1
Manufacturer No:
CC2745P10E0WRHARQ1
Manufacturer:
Texas Instruments
Package:
Description:
Automotive SimpleLink™ Bluetooth® 6.0 LE wireless MCU with 1MB flash, HSM, APU, CAN-FD, +20dBm
Quantity:
In Stock :6040
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Expected Shipping：Fri, Jun 5 - Sat, Jun 6, 2026
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Date Code：Within 2 Years
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CC2745P10E0WRHARQ1 Information
Texas Instruments CC2745P10E0WRHARQ1 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments CC2745P10E0WRHARQ1.
- Type
- Parameter
- Type
- Wireless MCU
- Technology
- 2.4 GHz, Bluetooth low energy
- Protocols
- Bluetooth Low Energy 5.4, Bluetooth Low Energy 6.0
- CPU
- Arm® Cortex®-M33
- Flash memory (kByte)
- 1024
- RAM (kByte)
- 162
- CAN (#)
- CAN-FD
- Number of GPIOs
- 23
- TX power (max) (dBm)
- 20
- Features
- AEC-Q100 Grade 2 qualified, DC/DC, Integrated Algorithm Processing Unit (APU), Integrated RF switch, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD
- Type
- Parameter
- Peripherals
- 1 Watchdog timer, 1 comparator, 12-bit ADC, 2 SPI, 2 UART, 4 timers, I2C, I2S, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC)
- Security
- AES 128-bit and 256-bit cryptographic accelerator, Differential power analysis protection, ECC and RSA public key hardware accelerator, Hardware security module (HSM), ISO21434 automotive cybersecurity compliant, SHA2 Accelerator (full suite up to SHA-512), Secure boot, Secure key storage, True random-number generator (TRNG), TrustZone support for Arm Cortex-M, Voltage glitch monitor (VGM)
- Rating
- Automotive
- Operating temperature range (°C)
- -40 to 125
- Package
- VQFN (RHA)
- Pins
- 40
- Size
- 36 mm² 6 x 6
- REACH Status
- Yes
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for Texas Instruments CC2745P10E0WRHARQ1.
Certificate:
Application note:
Technical article:
Data sheet:
The SimpleLink™ CC274xR-Q1 and CC274xP-Q1 devices are AEC-Q100 complaint wireless microcontrollers (MCUs) supporting Bluetooth Low Energy 5.4 for automotive applications. These devices are optimized for low-power wireless communication in applications such as car access, including passive entry passive start (PEPS), phone as a key (PaaK), and remote keyless entry (RKE). The key features of this device include:
- Support for features in Bluetooth 5.4 and earlier versions:
- LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
- Bluetooth Channel Sounding technology support and Algorithm Processing Unit (APU) to enable high accuracy, low cost, and secure phase-based ranging mechanism for distance estimation.
- APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT and super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC)
- ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
- Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
- Advanced security features for connected wireless MCUs:
- An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
- Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
- Arm Cortex M33 TrustZone-M based trusted execution environment support
- Secure key storage support with HSM and TrustZone-M
- Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
- Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
- Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
- Extended temperature support with the lowest standby current
- Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
- Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy
The CC274xR/P-Q1 devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
- Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
- Algorithm Processing Unit (APU) (96MHz)
- Mathematical accelerator for efficient vector and matrix operations
- Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
- Up to 1MB of in-system programmable flash
- Up to 162KB of SRAM
- 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
- Serial wire debug (SWD)
- AEC-Q100 Grade 2 qualified:
- –40°C to +125°C junction temperature
- HBM ESD Classification Level 2 (ESD HBM level 1C on RF pin, per AEC-Q100 Rev. J)
- CDM ESD Classification Level C2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)
- 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
- Two SWD IO pads, multiplexed with GPIOs
- Two LFXT IO pads, multiplexed with GPIOs
- 19 DIOs (analog or digital IOs)
- All GPIOs with wakeup and interrupt capabilities
- 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
- Real-time clock (RTC)
- Watchdog timer
- System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
- 12-bit ADC, up to 1.2MSPS, eight external inputs
- Temperature sensor and battery monitor
- 1× low-power comparator
- 2× UART with LIN capability
- 2× SPI
- 1× I2C
- 1× I2S
- 1× CAN-FD controller with CAN/CAN-FD ISO 16845-1:2016 certification compliance
- ISO21434 Automotive Cybersecurity Compliant
- Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
- AES (up to 256 bits) crypto accelerator
- ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
- SHA-2 (up to 512 bits) accelerator
- True random number generator
- HSM firmware update support
- Differential power analysis (DPA) countermeasures for AES and ECC
- Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
- Secure boot and secure firmware updates
- Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
- Voltage glitch monitor (VGM)
- On-chip buck DC/DC converter
- RX current: 6.1mA
- TX current at 0dBm: 7.7mA
- TX current at +10dBm: 24.5mA
- Active mode MCU 96MHz (CoreMark): 6.8mA
- Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
- Shutdown: 160nA
- Bluetooth Low Energy 5.4
- Bluetooth Low Energy 6.0 ready
- Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
- 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification
- Output power up to +10dBm (R version)
- Output power up to +20dBm (P version)
- Integrated BALUN
- Integrated RF switch
- Receiver sensitivity:
- Bluetooth LE 125kbps: –103.5dBm
- Bluetooth LE 1Mbps: –97dBm
Regulatory compliance
- Designed for systems targeting compliance with worldwide radio frequency regulations
- EN 300 328 (Europe)
- FCC CFR47 Part 15 (US)
- ARIB STD-T66 (Japan)
- LP-EM-CC2745R10-Q1 LaunchPad™ Development Kit
- BP-EM-CS Multiple antenna board for Bluetooth Channel Sounding
- SimpleLink™ Low Power F3 Software Development Kit (SDK)
- Fully qualified Bluetooth® software protocol stack in the SDK
- Up to 32 concurrent multirole connections
- Bluetooth Low Energy 5.4 Support
- CCC Digital Key 3 / ICCE Bluetooth APIs support for secure car access systems
- Fully qualified Bluetooth® software protocol stack in the SDK
- Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
- SysConfig system configuration tool
- SmartRF™ Studio for simple radio configuration
Operating ranges
- Junction temperature TJ: –40°C to 125°C
- Wide supply voltage range 1.71V to 3.8V
- 6mm × 6mm QFN40 with wettable flanks
- RoHS-compliant package
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