ROHM BR25G1MFJ-3GE2
Manufacturer No:
BR25G1MFJ-3GE2
Manufacturer:
ROHM
Package:
8-SOIC (0.154, 3.90mm Width)
Description:
Memory IC 4.9mm mm
Quantity:
In Stock :7478
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Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Mon, Jun 1 - Tue, Jun 2, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
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Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
BR25G1MFJ-3GE2 Information
ROHM BR25G1MFJ-3GE2 technical specifications, attributes, parameters and parts with similar specifications to ROHM BR25G1MFJ-3GE2.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Surface Mount
- YES
- Number of Pins
- 8
- Operating Temperature
- -40°C~85°C TA
- Packaging
- Cut Tape (CT)
- Published
- 2014
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- Type
- Parameter
- Number of Terminations
- 8
- Additional Feature
- SEATED HT-CALCULATED
- Technology
- CMOS
- Voltage - Supply
- 1.8V~5.5V
- Terminal Position
- DUAL
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Number of Functions
- 1
- Terminal Pitch
- 1.27mm
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Supply Voltage-Max (Vsup)
- 5.5V
Download datasheets and manufacturer documentation for ROHM BR25G1MFJ-3GE2.
BR25G1MFJ-3GE2 Overview
In terms of its memory type, it can be classified as Non-Volatile. The case comes in Cut Tape (CT) size. The case is embedded in 8-SOIC (0.154, 3.90mm Width). Memory size on the chip is 1Mb 128K x 8. This device uses takes advantage of the EEPROM format. The device's extended operating temperature range of -40°C~85°C TA makes it ideal for many demanding applications. The device is capable of handling a supply voltage of 1.8V~5.5V. The recommended mounting type for this device is Surface Mount. On the chip, there are 8 terminations. The comprehensive working procedure is supported by 1 functions in this part. There is a clock frequency rotation of the memory within a 10MHz range. An 8-pin package is used to package this memory device. It also features SEATED HT-CALCULATED to boost system performance despite all its merits. By integrating this memory with a SPI-type serial bus, data can be carried and transferred to the CPU easily.
BR25G1MFJ-3GE2 Features
Package / Case: 8-SOIC (0.154, 3.90mm Width)
8 Pins
Additional Feature:SEATED HT-CALCULATED
BR25G1MFJ-3GE2 Applications
There are a lot of ROHM Semiconductor
BR25G1MFJ-3GE2 Memory applications.
- eSRAM
- mainframes
- multimedia computers
- networking
- personal computers
- servers
- supercomputers
- telecommunications
- workstations,
- DVD disk buffer
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
