BROADCOM BCM56992B0KFLGG

Manufacturer No:

BCM56992B0KFLGG

Manufacturer:

BROADCOM

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Description:

StrataXGS® Trident II family of Ethernet switch chips

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In Stock :Available

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BCM56992B0KFLGG information

BROADCOM BCM56992B0KFLGG technical specifications, attributes, parameters and parts with similar specifications to BROADCOM BCM56992B0KFLGG.

Type
Parameter

Switching Capacity
Up to 1.28 Tbps (full duplex)

Packet Forwarding Rate
Up to 960 million packets per second

Port Configuration
48x 10GbE ports

Buffer Memory
On-chip packet buffering for efficient traffic management

Package Type
BGA (Ball Grid Array)

Packet Forwarding
High-performance, low-latency forwarding

Buffer Architecture
Deep buffer for congestion management

Switching Modes
Cut-through and store-and-forward

Traffic Management
Advanced QoS and traffic shaping

Power Efficiency
Advanced power-saving technologies

Integration
Integrated SerDes, flip-chip BGA packaging

Software Support
Broadcom SDK, SAI, ONIE

Target Applications
Data center ToR/spine switches, enterprise core/aggregation switches, cloud networking

Download datasheets and manufacturer documentation for BROADCOM BCM56992B0KFLGG.

Datasheet:

aaf9a4ec-526c-4b48-abf9-c3fce6b5e960.PDF

BCM56992B0KFLGG refers to a high-performance Ethernet switch chip from Broadcom, specifically part of the Tomahawk 4 series. This series is designed to meet the demands of next-generation data center and cloud computing environments.

Key Specifications of BCM56992B0KFLGG

1. Performance and Capacity

Switching Capacity: Up to 1.28 Tbps (full duplex).
Packet Forwarding Rate: Up to 960 million packets per second (MPPS).
Port Configuration:
- 48x 10GbE ports (10 Gigabit Ethernet).
- 12x 40GbE/100GbE uplinks (supports breakout to 4x 10GbE or 4x 25GbE).
Buffer Memory: On-chip packet buffering for efficient traffic management.

2. Advanced Features

Layer 2/Layer 3 Switching: Full support for Layer 2 and Layer 3 protocols.
Virtualization: Supports VXLAN, NVGRE, and MPLS for network virtualization.
Quality of Service (QoS): Advanced traffic prioritization and congestion management.
Access Control Lists (ACLs): Fine-grained traffic filtering and security.
Load Balancing: Supports ECMP (Equal-Cost Multi-Path) for efficient traffic distribution.
Telemetry: Advanced monitoring and analytics capabilities.

3. Programmability

Flexible Pipeline: Programmable packet processing pipeline for custom applications.
SDN Support: Compatible with Software-Defined Networking (SDN) frameworks like OpenFlow.

4. Energy Efficiency

Low Power Consumption: Designed for energy-efficient operation, reducing operational costs in large-scale deployments.
Dynamic Power Management: Adjusts power usage based on traffic load.

5. Physical Characteristics

Package Type: BGA (Ball Grid Array).
Pin Count: Likely in the range of 1000+ pins (exact count depends on the specific variant).
Operating Temperature: Typically 0°C to 70°C (commercial) or -40°C to 85°C (industrial), depending on the variant.

6. Applications

Data Center Switches: Top-of-rack (ToR), leaf-spine architectures.
Enterprise Networks: Core and aggregation switches.
Cloud Networking: High-density, high-performance cloud infrastructure.

7. Software and Tools

SDK: Broadcom provides a Software Development Kit (SDK) for configuring and managing the switch.
APIs: Comprehensive APIs for integration with network operating systems (NOS).

Typical Use Cases

Data Center Interconnects: High-speed connectivity for servers and storage.
Cloud Infrastructure: Scalable and flexible networking for cloud service providers.
Enterprise Networks: High-performance switching for large organizations.

These specifications position the BCM56992B0KFLGG as a robust solution for high-capacity networking needs, offering substantial bandwidth and port density suitable for large-scale data centers.

User Guide

PURCHASE

Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.

MEANS OF PAYMENT

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.

RFQ (REQUEST FOR QUOTATIONS)

Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1：Prepare product

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step4：Individual Package

Step5：Anti-collision Filling

Step6：Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.