STMicroelectronics BALF-WL-00D3
Manufacturer No:
BALF-WL-00D3
Manufacturer:
STMicroelectronics
Package:
Description:
Balun,filtering and matching for STM32WL high power and low power in BGA package system in package
Quantity:
In Stock :1199
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Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Fri, May 29 - Sat, May 30, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
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Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
BALF-WL-00D3 Information
STMicroelectronics BALF-WL-00D3 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics BALF-WL-00D3.
- Type
- Parameter
- Operating Temp Min Celsius
- 105.0
- Operating Temp Max Celsius
- -40.0
- ECCN US
- EAR99
- ECCN EU
- NEC
- Packing Type
- Tape And Reel
- RoHS Status
- Grade
- Industrial
- Package Name
- Chip Scale Package 0.4mm pitch
- Operating Temp Min Celsius
- 105.0
- Operating Temp Max Celsius
- -40.0
- Type
- Parameter
- ECCN US
- EAR99
- ECCN EU
- NEC
- Packing Type
- Tape And Reel
- RoHS Status
- Grade
- Industrial
- Package Name
- Chip Scale Package 0.4mm pitch
Download datasheets and manufacturer documentation for STMicroelectronics BALF-WL-00D3.
Data sheet:
Material Declaration:
STMicroelectronics BALF-WL-00D3 is an ultra-miniature balun. This device integrates a matching network, balun, and harmonics filter. Matching impedance has been customized for the STM32WL sub-GHz wireless microcontrollers.
It is using STMicroelectronics IPD technology on a nonconductive glass substrate, which optimizes RF performances.
- Module STM32WL sub-GHz wireless microcontrollers impedance matched balun and Tx harmonics filter
- Optimized for module STM32WL sub-GHz wireless microcontrollers in high and low power modes and dedicated to module package
- 50 Ω nominal input / conjugate match balun to module STM32WL
- 50 Ω nominal impedance on antenna side Tx and Rx
- Deep Tx rejection harmonic filter
- Low insertion loss
- Small footprint
- Low profile ≤ 630 μm after reflow
- High RF performance
- RF BOM and area reduction
- ECOPACK2 compliant component
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
