AM62P52CVMHIAMHR-Texas Instruments-Price, Stock & Datasheet

The AM62Px (P = Plus) is an extension of the existing Sitara™ AM62x low-cost family of application processors built for high-performance embedded 3D display applications. Scalable Arm® Cortex®-A53 performance and embedded features, such as: multi-screen high-definition display support, 3D-graphics acceleration, 4K video acceleration, and extensive peripherals make the AM62Px well-suited for a broad range of automotive and industrial applications, including automotive digital instrumentation, automotive displays, industrial HMI, and more.

Key features and benefits:

Focus on innovation and fast development with Linux and Android™ SDKs accompanied with real-time functional safety and security SDKs.
Address next wave of HMI designs with new generation of 3D GPU and 4K video acceleration.
Enhance your design connectivity with an extensive set of automotive and high-speed IOs, including: 4x CAN-FD, 3-port Gigabit Ethernet switch (two external ports) with TSN support, and two USB2.0 ports.
Supports the latest cybersecurity requirements with the built-in Hardware Security Module (HSM).
Provides intelligent features, such as: facial recognition and touchless HMI with Arm® Cortex®-A53 CPUs and open-source AI software and tools

The AM62Px processors comply with the AEC - Q100 automotive standard and support industrial-grade. ASIL-B and SIL-2 functional safety requirements can be addressed using an integrated Arm Cortex-R5F core and dedicated peripherals, which can all be isolated from the rest of the processor.

Products in the AM62Px processor family:

AM62P-Q1 – Automotive digital instrumentation SoC with scalable Arm Cortex-A53 performance, multi high-definition display support, 3D GPU and 4K video acceleration.

Featured design resources:

Hardware Evaluation Module (EVM) - SK-AM62P-LP
Software Development Kit (SDK) - PROCESSOR-SDK-AM62P
Linux Academy

Processor Cores:

Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4GHz
- Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
- Each A53 core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
Single-core Arm Cortex-R5F at up to 800MHz, integrated as part of MCU Channel with FFI
- 32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories
- 512KB SRAM with SECDED ECC
Single-core Arm Cortex-R5F at up to 800MHz, integrated to support Device Management
- 32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories

Multimedia:

Display subsystem
- Triple display support over OLDI (LVDS) (1x OLDI-DL, 1x or 2x OLDI-SL), DSI or DPI
  - OLDI-SL (Single Link): up to 1920 x 1080 at 60fps (165MHZ Pixel Clock)
  - OLDI-DL (Dual Link): up to 3840 x 1080 at 60fps (150MHz Pixel Clock)
  - MIPI DSI: with 4 Lane MIPI® D-PHY supports up to 3840 x 1080 at 60fps (300MHz Pixel Clock)
  - DPI (24-bit RGB parallel interface): up to 1920 x 1080 at 60fps (165MHz pixel clock)
- Four display pipelines with hardware overlay support. A maximum of two display pipelines may be used per display.
- Supports safety features such as freeze frame detection and data correctness check
3D Graphics Processing Unit
- IMG BXS-4-64 with 256KB cache
- Up to 50GFLOPS
- Single shader core
- OpenGL ES3.2 and Vulkan 1.2 API support
One Camera Serial Interface (CSI-2) Receiver with 4 Lane D-PHY
- MIPI® CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
- Support for 1,2,3 or 4 data lane mode up to 2.5Gbps per lane
- ECC verification/correction with CRC check + ECC on RAM
- Virtual Channel support (up to 16)
- Ability to write stream data directly to DDR via DMA
Video Encoder/Decoder
- Support for HEVC (H.265) Main profiles at Level 5.1 High-tier
- Support for H.264 BaseLine/Main/High Profiles at Level 5.2
- Support for up to 4K UHD resolution (3840 × 2160)
  - Up to 300MPixels/s operation, with reduced clocking options available for lower power applications with lower performance needs

Memory Subsystem:

Up to 1.09MB of On-chip RAM
- 64KB of On-Chip RAM (OCRAM) with SECDED ECC, can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
- 256KB of On-Chip RAM with SECDED ECC in SMS Subsystem
- 176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
- 512KB of On-chip RAM with SECDED ECC in Cortex-R5F MCU Subsystem
- 64KB of On-chip RAM with SECDED ECC in Device Manager Subsystem
DDR Subsystem (DDRSS)
- Supports LPDDR4 memory type
- 32-bit data bus with inline ECC
- Supports speeds up to 3733MT/s
- Max size of 8GB

Functional Safety:

Functional Safety-Compliant targeted [Industrial]
- Developed for functional safety applications
- Documentation will be available to aid IEC 61508 functional safety system design
- Systematic capability up to SIL 3 targeted
- Hardware Integrity up to SIL 2 targeted
- Safety-related certification
  - IEC 61508 by TÜV SÜD planned
Functional Safety-Compliant targeted [Automotive]
- Developed for functional safety applications
- Documentation will be available to aid ISO 26262 functional safety system design
- Systematic capability up to ASIL D targeted
- Hardware integrity up to ASIL B targeted
- Safety-related certification
  - ISO 26262 by TÜV SÜD planned
AEC - Q100 qualified [Automotive]

Security:

Secure boot supported
- Hardware-enforced Root-of-Trust (RoT)
- Support to switch RoT via backup key
- Support for takeover protection, IP protection, and anti-roll back protection
Trusted Execution Environment (TEE) supported
- Arm TrustZone based TEE
- Extensive firewall support for isolation
- Secure watchdog/timer/IPC
- Secure storage support
- Replay Protected Memory Block (RPMB) support
Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing
Cryptographic acceleration supported
- Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
  - Supports cryptographic cores
- AES – 128-/192-/256-Bit key sizes
- SHA2 – 224-/256-/384-/512-Bit key sizes
- DRBG with true random number generator
- PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
Debugging security
- Secure software controlled debug access
- Security aware debugging

High-Speed Interfaces:

Integrated Ethernet switch supporting (total 2 external ports)
- RMII(10/100) or RGMII (10/100/1000)
- IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
- Clause 45 MDIO PHY management
- Packet Classifier based on ALE engine with 512 classifiers
- Priority based flow control
- Time Sensitive Networking (TSN) support
- Four CPU H/W interrupt Pacing
- IP/UDP/TCP checksum offload in hardware
Two USB2.0 Ports
- Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
- Integrated USB VBUS detection

General Connectivity:

9x Universal Asynchronous Receiver-Transmitters (UART)
5x Serial Peripheral Interface (SPI) controllers
6x Inter-Integrated Circuit (I2C) ports
3x Multichannel Audio Serial Ports (McASP)
- Transmit and Receive Clocks up to 50MHz
- Up to 4/6/16 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
- Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
- Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
- FIFO Buffers for Transmit and Receive (256 Bytes)
- Support for audio reference output clock
3x enhanced PWM modules (ePWM)
3x enhanced Quadrature Encoder Pulse modules (eQEP)
3x enhanced Capture modules (eCAP)
General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
4x Controller Area Network (CAN) modules with CAN-FD support
- Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
- Full CAN-FD support (up to 64 data bytes)
- Parity/ECC check for Message RAM
- Speed up to 8Mbps

Media and Data Storage:

3x Multi-Media Card/Secure Digital (MMC/SD/SDIO) interfaces
- 1x 8-bit eMMC interface up to:
  - HS200 for non-Q1 devices
  - HS400 for Q1 devices
- 2x 4-bit SD/SDIO interfaces up to UHS-I
- Compliant with eMMC 5.1, SD 3.0, and SDIO Version 3.0
1× General-Purpose Memory Controller (GPMC) up to 133MHz
- Flexible 8- and 16-bit Asynchronous Memory Interface with up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
- Uses BCH code to support 4-, 8-, or 16-bit ECC
- Uses Hamming code to support 1-bit ECC
- Error Locator Module (ELM)
  - Used with the GPMC to locate addresses of data errors from syndrome polynomials generated using a BCH algorithm
  - Supports 4-, 8-, and 16-bit per 512-Byte block error location based on BCH algorithms
OSPI/QSPI with DDR / SDR support
- Support for Serial NAND and Serial NOR Flash devices
- 4GBytes memory address support
- XIP mode with optional on-the-fly encryption

Power Management:

Low-power modes supported by Device Manager:
- Partial IO support for CAN/GPIO/UART wakeup
- I/O Only + DDR in Self Refresh for Suspend to RAM
- DeepSleep
- MCU Only
- Standby
- Dynamic frequency scaling

Optimal Power Management Solution:

Recommended TI Power Management ICs (PMIC)
- Supports up to Automotive ASIL-B functional safety when powering the AEC – Q100 qualified AM62P-Q1 device
- Supports up to SIL-2 functional safety industrial applications when powering the AM62P device
- Companion PMIC is specially designed to meet power supply requirements
- Flexible mapping and factory programmed configurations to support different use cases

Boot Options: