Microchip AFS090-2FG256

Manufacturer No:

AFS090-2FG256

Manufacturer:

Microchip

Package:

256-LBGA

Description:

1.5V V FPGAs Fusion® Series 256-LBGA

Quantity:

In Stock :9106

Looking for price or availability? Send us an RFQ and our sales team will respond quickly.

Shipping & Availability

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Shipped from：HK Warehouse

Expected Shipping：Mon, May 11 - Tue, May 12, 2026

Lead Time：Inquire about availability

Date Code：Within 2 Years

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PURCHASE

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IMPORTANT NOTICE

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Step1：Prepare product

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step4：Individual Package

Step5：Anti-collision Filling

Step6：Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

AFS090-2FG256 Information

Microchip AFS090-2FG256 technical specifications, attributes, parameters and parts with similar specifications to Microchip AFS090-2FG256.

Type
Parameter

Mount
Surface Mount

Mounting Type
Surface Mount

Package / Case
256-LBGA

Number of Pins
256

Supplier Device Package
256-FPBGA (17x17)

Weight
400.011771mg

Operating Temperature
0°C~85°C TJ

Packaging
Tray

Series
Fusion®

Published
2013

Type
Parameter

Part Status
Obsolete

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Max Operating Temperature
70°C

Min Operating Temperature
0°C

Voltage - Supply
1.425V~1.575V

Base Part Number
AFS090

Operating Supply Voltage
1.5V

Max Supply Voltage
1.575V

Min Supply Voltage
1.425V

Number of I/O
75

Download datasheets and manufacturer documentation for Microchip AFS090-2FG256.

Datasheets:

microsemicorporation-afs090fgg256i-datasheets-2971.pdf

AFS090-2FG256 Overview

The package that contains this software is called 256-LBGA. There are 75 I/Os for better data transfer. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.425V~1.575V battery. There are many types of FPGAs in the Fusion® series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 27648. If you are looking for related parts, you can use the base part number AFS090 as a starting point. For the program to work properly, the RAM si3.4kBe of this FPGA module must reach 3.4kB GB in order to ensure normal operation. In this case, 256 pins are used in the design. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 1.5V supply voltage. When this module is operated at its maximum operating temperature, it reaches 70°C. A higher operating temperature than 0°C is recommended. As a basic building block, fpga semiconductor consists of 90000 gates. In order to store and transfer data, a total of 2304 registers are used. This device is capable of supporting a maximum supply voltage of 1.575V. Using 1.425V as the minimum supply voltage, fpga semiconductor can operate. As fast as 1.47059GHz can be reached with this FPGA. The supplier of the device package is 256-FPBGA (17x17).