Microchip A2F500M3G-1FGG256
Manufacturer No:
A2F500M3G-1FGG256
Manufacturer:
Microchip
Package:
256-LBGA
Description:
0°C~85°C TJ 256 Pin A2F500M3G System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O Min 1.425V V Max 1.575V V
Quantity:
In Stock :3733
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Shipped from：HK Warehouse
Expected Shipping：Sun, Jun 7 - Mon, Jun 8, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
A2F500M3G-1FGG256 Information
Microchip A2F500M3G-1FGG256 technical specifications, attributes, parameters and parts with similar specifications to Microchip A2F500M3G-1FGG256.
- Type
- Parameter
- Mount
- Surface Mount
- Package / Case
- 256-LBGA
- Number of Pins
- 256
- Supplier Device Package
- 256-FPBGA (17x17)
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- SmartFusion®
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Max Operating Temperature
- 85°C
- Type
- Parameter
- Min Operating Temperature
- 0°C
- Frequency
- 100MHz
- Base Part Number
- A2F500M3G
- Operating Supply Voltage
- 1.5V
- Interface
- EBI/EMI, Ethernet, I2C, SPI, UART, USART
- Max Supply Voltage
- 1.575V
- Min Supply Voltage
- 1.425V
- Memory Size
- 13.5kB
- Operating Supply Current
- 16.5mA
- Number of I/O
- MCU - 25, FPGA - 66
Download datasheets and manufacturer documentation for Microchip A2F500M3G-1FGG256.
This SoC is built on ARM® Cortex®-M3 core processor(s).
ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 256-LBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion® series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.Taking note of the fact that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has MCU - 25, FPGA - 66 I/Os.A flashing 512KB appears on it.Searching A2F500M3G will bring up system on chips with similar specs and purposes.At 100MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 256-pin version.The SoC computing will start only if 0°C is set.This SoC system on chip is designed to operate at a temperature of 85°C.There is a maximum supply voltage of 1.575V.A minimum of 1.425V are supplied to it.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F500M3G-1FGG256 System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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