Microchip A2F060M3E-1FGG256
Manufacturer No:
A2F060M3E-1FGG256
Manufacturer:
Microchip
Package:
256-LBGA
Description:
0°C~85°C TJ 256 Pin A2F060M3E System On Chip SmartFusion® Series MCU - 26, FPGA - 66 I/O Min 1.425V V Max 1.575V V
Quantity:
In Stock :9319
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Shipped from：HK Warehouse
Expected Shipping：Fri, Jun 12 - Sat, Jun 13, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Step2：Desiccant Protection
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Step6：Packaging Box
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
A2F060M3E-1FGG256 Information
Microchip A2F060M3E-1FGG256 technical specifications, attributes, parameters and parts with similar specifications to Microchip A2F060M3E-1FGG256.
- Type
- Parameter
- Package / Case
- 256-LBGA
- Number of Pins
- 256
- Supplier Device Package
- 256-FPBGA (17x17)
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- SmartFusion®
- Part Status
- Obsolete
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Max Operating Temperature
- 85°C
- Min Operating Temperature
- 0°C
- Type
- Parameter
- Frequency
- 100MHz
- Base Part Number
- A2F060M3E
- Operating Supply Voltage
- 1.5V
- Interface
- EBI/EMI, I2C, SPI, UART, USART
- Max Supply Voltage
- 1.575V
- Min Supply Voltage
- 1.425V
- Number of I/O
- MCU - 26, FPGA - 66
- Speed
- 100MHz
- RAM Size
- 16KB
- Core Processor
- ARM® Cortex®-M3
Download datasheets and manufacturer documentation for Microchip A2F060M3E-1FGG256.
This SoC is built on ARM® Cortex®-M3 core processor(s).
There are ARM® Cortex®-M3 core processors in this SoC.This system on a chip is packaged as 256-LBGA by the manufacturer.As this SoC chip has 16KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion® series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of MCU - 26, FPGA - 66 I/Os.The flash is set to 128KB.By searching A2F060M3E, you can find system on chips with similar specs and purposes.There is 100MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.256 pins are present on this computer SoC.It is just enough to start the SoC computing at 0°C.As designed, this SoC system on chip can operate at a maximum temperature of 85°C.Voltage of maximum supply is 1.575V.The SoC security is powered at least by 1.425V.
ARM® Cortex®-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-1FGG256 System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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