Renesas 74CBTLV3253QG
Renesas 74CBTLV3253QG

Renesas 74CBTLV3253QG

Manufacturer No:

74CBTLV3253QG

Manufacturer:

Renesas

Package:

QSOP

Description:

16 Terminations 16 Pin Signal switch 4 Outputs 2 Functions Min 2.3V V Max 3.6V V

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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74CBTLV3253QG information

Renesas 74CBTLV3253QG technical specifications, attributes, parameters and parts with similar specifications to Renesas 74CBTLV3253QG.

  • Type
  • Parameter
  • Factory Lead Time
  • 7 Weeks
  • Contact Plating
  • Tin
  • Mount
  • Surface Mount
  • Package / Case
  • QSOP
  • Number of Pins
  • 16
  • Published
  • 2006
  • JESD-609 Code
  • e3
  • Pbfree Code
  • yes
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 1 (Unlimited)
  • Number of Terminations
  • 16
  • ECCN Code
  • EAR99
  • Max Operating Temperature
  • 85°C
  • Min Operating Temperature
  • -40°C
  • Subcategory
  • Other Logic ICs
  • Technology
  • CMOS
  • Terminal Position
  • DUAL
  • Terminal Form
  • GULL WING
  • Peak Reflow Temperature (Cel)
  • 260
  • Number of Functions
  • 2
  • Supply Voltage
  • 2.5V
  • Terminal Pitch
  • 0.635mm
  • Pin Count
  • 16
  • Number of Outputs
  • 4
  • Temperature Grade
  • INDUSTRIAL
  • Max Supply Voltage
  • 3.6V
  • Min Supply Voltage
  • 2.3V
  • Number of Bits
  • 8
  • Propagation Delay
  • 5.5 ns
  • Quiescent Current
  • 10?A
  • Family
  • CBTLV/3B
  • Logic Function
  • Demultiplexer, Multiplexer
  • Number of Inputs
  • 4
  • Output Characteristics
  • 3-STATE
  • Supply Type
  • Single
  • Output Polarity
  • TRUE
  • Logic IC Type
  • MULTIPLEXER AND DEMUX/DECODER
  • High Level Output Current
  • -128mA
  • Low Level Output Current
  • 128mA
  • Independent Circuits
  • 1
  • Length
  • 4.9mm
  • Width
  • 3.8mm
  • Thickness
  • 1.47mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Lead Free

Download datasheets and manufacturer documentation for Renesas 74CBTLV3253QG.

74CBTLV3253QG Overview


Digital switch is provided in the QSOP for the purpose of saving board space.As parts of its basic configuration, 16 terminations are desgined.The voltage supplied for multiplexer's system is 2.5V.multiplexer's systemThere are 16 component pins in this turn signal switch.It employs GULL WING as the point at which conductors come to an end.Single is employed as its supply type.It is configured with 16 pins.It is mounted in the way of Surface Mount.The logic switch is included into the family of CBTLV/3B.There are 8 bits signal multiplexer provides.The power supply of 2.5/3.3V is provided for mux switch's normal operation.There are 4 outputs designed for the operation of the turn signal switch.The digital switch ic is an electronic part classified into Other Logic ICs.Not being affected by the external factors, consumes 10?A current of multiplexer ic.There are 4 inputs provided in this multiplexer.It is acceptable for this signal switch to operate at the maximal temperature of 85°C.The minimal operating temperature of the multiplexer should be maintained at -40°C.The signal switches is specified to operate at the maximum supply voltage of 3.6V in compliance with the applicable device specification.The digital swith is specified to operate at the minimum supply voltage of 2.3V in compliance with the applicable device specification.It employs MULTIPLEXER AND DEMUX/DECODER as its logic IC.

74CBTLV3253QG Features


Supplied in the QSOP package
Adopting a supply type of Single
Power supplies of 2.5/3.3V
MULTIPLEXER AND DEMUX/DECODER as the logic IC


74CBTLV3253QG Applications


There are a lot of Integrated Device Technology (IDT)
74CBTLV3253QG Signal Switches / Multiplexers / Decoders applications.


  • Communication system
  • Telephone network
  • Computer memory
  • Transmission from the computer system of a satellite
  • Time division multiplexing system
  • Frequency multiplexing system
  • A/D converters
  • D/A converters
  • Implementing boolean functions with multiple variables
  • Data collection system

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Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

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Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

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Step6:Packaging Box

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