Renesas 70V3399S166BFG
Renesas 70V3399S166BFG

Renesas 70V3399S166BFG

Manufacturer No:

70V3399S166BFG

Manufacturer:

Renesas

Package:

Description:

208 Pin Memory IC 2.3 Mb kb 15mm mm

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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70V3399S166BFG information

Renesas 70V3399S166BFG technical specifications, attributes, parameters and parts with similar specifications to Renesas 70V3399S166BFG.

  • Type
  • Parameter
  • Factory Lead Time
  • 16 Weeks
  • Surface Mount
  • YES
  • Number of Pins
  • 208
  • Packaging
  • Bulk
  • Published
  • 2009
  • JESD-609 Code
  • e1
  • Pbfree Code
  • yes
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 208
  • Terminal Finish
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Max Operating Temperature
  • 70°C
  • Min Operating Temperature
  • 0°C
  • Additional Feature
  • FLOW-THROUGH OR PIPELINED ARCHITECTURE
  • Subcategory
  • SRAMs
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 260
  • Number of Functions
  • 1
  • Supply Voltage
  • 3.3V
  • Terminal Pitch
  • 0.8mm
  • Frequency
  • 166MHz
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Pin Count
  • 208
  • Temperature Grade
  • COMMERCIAL
  • Interface
  • Parallel
  • Max Supply Voltage
  • 3.45V
  • Min Supply Voltage
  • 3.15V
  • Memory Size
  • 256kB
  • Number of Ports
  • 2
  • Memory Type
  • RAM, SDR, SRAM
  • Supply Current-Max
  • 0.5mA
  • Frequency (Max)
  • 166MHz
  • Access Time
  • 3.6 ns
  • Output Characteristics
  • 3-STATE
  • Memory Width
  • 18
  • Address Bus Width
  • 34b
  • Density
  • 2.3 Mb
  • Standby Current-Max
  • 0.03A
  • I/O Type
  • COMMON
  • Length
  • 15mm
  • Height Seated (Max)
  • 1.7mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for Renesas 70V3399S166BFG.

70V3399S166BFG Overview


As far as memory types are concerned, RAM, SDR, SRAM is considered to be its memory type. In addition, memory ics is available in a Bulk case as well. A memory chip with a capacity of 256kB is used on this device. On the chip, there are 208 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 3.3V. The memory device has an 208-pin package, which encloses it in a small package. I have noticed that the memory device has 208 pins, which indicates that it has 208 locations in the memory. According to the datasheet, this memory chip operates at an operating voltage of 3.3V. The memory chip also offers FLOW-THROUGH OR PIPELINED ARCHITECTURE to level up system performance despite its merits. The memory chip has 2 ports for granting read/write access to one memory address. There are I/O ports on this memory ics that have COMMON-bit memory mapping. Temperatures below 0°C should not be used with this memory ics. It is recommended that operation of the part be restricted to temperatures not exceeding 70°C, otherwise damage to the part may occur as a result of overheating. As far as the supply current is concerned, it can be operated with a maximum of 0.5mA of currentIn most cases, this memory ics is regarded as being a type of SRAMs. It is recommended that this part be supplied with at least 3.15V volts. The operating voltage shall not exceed 3.45V. A ic memory chip like this one processes data at a frequency of 166MHz bits per second. A memory chip of this type can operate at a maximum frequency of 166MHz.

70V3399S166BFG Features


208 Pins
Operating Supply Voltage:3.3V
Additional Feature:FLOW-THROUGH OR PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 166MHz
166MHz terminals


70V3399S166BFG Applications


There are a lot of Integrated Device Technology (IDT)
70V3399S166BFG Memory applications.


  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM

User Guide

PURCHASE

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IMPORTANT NOTICE

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Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

SHIPPING COST

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3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.