Renesas 70V3319S133BCGI
Renesas 70V3319S133BCGI

Renesas 70V3319S133BCGI

Manufacturer No:

70V3319S133BCGI

Manufacturer:

Renesas

Package:

Description:

Surface Mount 256 Pin Memory IC 4.5 Mb kb 17mm mm 480mA mA 18b b

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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70V3319S133BCGI information

Renesas 70V3319S133BCGI technical specifications, attributes, parameters and parts with similar specifications to Renesas 70V3319S133BCGI.

  • Type
  • Parameter
  • Factory Lead Time
  • 7 Weeks
  • Mount
  • Surface Mount
  • Number of Pins
  • 256
  • Published
  • 2009
  • JESD-609 Code
  • e1
  • Pbfree Code
  • yes
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 256
  • Terminal Finish
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Max Operating Temperature
  • 85°C
  • Min Operating Temperature
  • -40°C
  • Additional Feature
  • FLOW-THROUGH OR PIPELINED ARCHITECTURE
  • Subcategory
  • SRAMs
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 260
  • Number of Functions
  • 1
  • Supply Voltage
  • 3.3V
  • Terminal Pitch
  • 1mm
  • Frequency
  • 133MHz
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Pin Count
  • 256
  • Temperature Grade
  • INDUSTRIAL
  • Interface
  • Parallel
  • Max Supply Voltage
  • 3.45V
  • Min Supply Voltage
  • 3.15V
  • Memory Size
  • 512kB
  • Number of Ports
  • 2
  • Nominal Supply Current
  • 480mA
  • Memory Type
  • RAM, SDR, SRAM
  • Frequency (Max)
  • 133MHz
  • Access Time
  • 4.2 ns
  • Output Characteristics
  • 3-STATE
  • Address Bus Width
  • 36b
  • Density
  • 4.5 Mb
  • Standby Current-Max
  • 0.04A
  • I/O Type
  • COMMON
  • Sync/Async
  • Synchronous
  • Word Size
  • 18b
  • Length
  • 17mm
  • Height Seated (Max)
  • 1.7mm
  • Width
  • 17mm
  • Thickness
  • 1.4mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for Renesas 70V3319S133BCGI.

70V3319S133BCGI Overview


As far as memory types are concerned, RAM, SDR, SRAM is considered to be its memory type. A memory chip with a capacity of 512kB is used on this device. On the chip, there are 256 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 3.3V. The memory device has an 256-pin package, which encloses it in a small package. I have noticed that the memory device has 256 pins, which indicates that it has 256 locations in the memory. According to the datasheet, this memory chip operates at an operating voltage of 3.3V. In this chip, the Surface Mount mounting method is used, a straightforward, high-efficiency mounting method. In terms of its nominal supply current, this memory component has a rating of 480mA. The memory chip also offers FLOW-THROUGH OR PIPELINED ARCHITECTURE to level up system performance despite its merits. The memory chip has 2 ports for granting read/write access to one memory address. There are I/O ports on this memory ics that have COMMON-bit memory mapping. Temperatures below -40°C should not be used with this memory ics. It is recommended that operation of the part be restricted to temperatures not exceeding 85°C, otherwise damage to the part may occur as a result of overheating. In most cases, this memory ics is regarded as being a type of SRAMs. It is recommended that this part be supplied with at least 3.15V volts. The operating voltage shall not exceed 3.45V. A ic memory chip like this one processes data at a frequency of 133MHz bits per second. A memory chip of this type can operate at a maximum frequency of 133MHz.

70V3319S133BCGI Features


256 Pins
Operating Supply Voltage:3.3V
Additional Feature:FLOW-THROUGH OR PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 133MHz
133MHz terminals


70V3319S133BCGI Applications


There are a lot of Integrated Device Technology (IDT)
70V3319S133BCGI Memory applications.


  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM

User Guide

PURCHASE

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Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

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Step6:Packaging Box

SHIPPING COST

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3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.