

Renesas 70T3799MS166BBG
Manufacturer No:
70T3799MS166BBG
Manufacturer:
Package:
BGA
Description:
324 Pin Memory IC 9 Mb kb 19mm mm
Quantity:
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In Stock :Available
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70T3799MS166BBG information
Renesas 70T3799MS166BBG technical specifications, attributes, parameters and parts with similar specifications to Renesas 70T3799MS166BBG.
- Type
- Parameter
- Factory Lead Time
- 14 Weeks
- Package / Case
- BGA
- Surface Mount
- YES
- Number of Pins
- 324
- Published
- 2010
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 324
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- Max Operating Temperature
- 70°C
- Min Operating Temperature
- 0°C
- Additional Feature
- PIPELINED OR FLOW-THROUGH ARCHITECTURE
- Subcategory
- SRAMs
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 260
- Number of Functions
- 1
- Supply Voltage
- 2.5V
- Terminal Pitch
- 1mm
- Frequency
- 166MHz
- Time@Peak Reflow Temperature-Max (s)
- 30
- Operating Supply Voltage
- 2.5V
- Temperature Grade
- COMMERCIAL
- Interface
- Parallel
- Number of Ports
- 2
- Memory Type
- RAM, SRAM
- Supply Current-Max
- 0.9mA
- Output Characteristics
- 3-STATE
- Address Bus Width
- 34b
- Density
- 9 Mb
- I/O Type
- COMMON
- Length
- 19mm
- Width
- 19mm
- Thickness
- 1.76mm
- Radiation Hardening
- No
- RoHS Status
- RoHS Compliant
- Lead Free
- Lead Free
Download datasheets and manufacturer documentation for Renesas 70T3799MS166BBG.
70T3799MS166BBG Overview
RAM, SRAM is the type of memory it has. The BGA case contains it. The chip has 324 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 2.5V of power. The memory device is enclosed in a package with an 324-pin connector. There are 324 pins on this memory device, which indicates it has 324 memory locations in it. A voltage of 2.5V is noted as the operating supply voltage for this memory. Despite all its merits, this chip also features PIPELINED OR FLOW-THROUGH ARCHITECTURE to boost system performance. A memory address is accessed through 2 ports on this chip. I/O port addresses on this device are mapped to memory addresses of COMMON bits. This device must operate at a minimum temperature of 0°C. Temperatures no higher than 70°C degrees Celsius are recommended for operation. A maximum supply current of 0.9mA can be used to operate this device. It is usually considered a type of SRAMs component. Data is processed by this memory ics at a frequency of 166MHz.
70T3799MS166BBG Features
Package / Case: BGA
324 Pins
Operating Supply Voltage:2.5V
Additional Feature:PIPELINED OR FLOW-THROUGH ARCHITECTURE
I/O Type: COMMON
Freguency at 166MHz
166MHz terminals
70T3799MS166BBG Applications
There are a lot of Integrated Device Technology (IDT)
70T3799MS166BBG Memory applications.
- cell phones
- eSRAM
- mainframes
- multimedia computers
- networking
- personal computers
- servers
- supercomputers
- telecommunications
- workstations,
User Guide
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Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

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