Renesas 70T3509MS133BPI
Manufacturer No:
70T3509MS133BPI
Manufacturer:
Package:
BGA
Description:
Surface Mount 256 Pin Memory IC 36 Mb kb 17mm mm 1.37A mA 36b b
Quantity:
Delivery:
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In Stock :Available
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70T3509MS133BPI information
Renesas 70T3509MS133BPI technical specifications, attributes, parameters and parts with similar specifications to Renesas 70T3509MS133BPI.
- Type
- Parameter
- Factory Lead Time
- 14 Weeks
- Mount
- Surface Mount
- Package / Case
- BGA
- Number of Pins
- 256
- Packaging
- Bulk
- Published
- 2009
- JESD-609 Code
- e0
- Pbfree Code
- no
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 256
- Terminal Finish
- Tin/Lead (Sn63Pb37)
- Max Operating Temperature
- 85°C
- Min Operating Temperature
- -40°C
- Additional Feature
- FLOW-THROUGH OR PIPELINED ARCHITECTURE
- Subcategory
- SRAMs
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 225
- Number of Functions
- 1
- Supply Voltage
- 2.5V
- Terminal Pitch
- 1mm
- Frequency
- 133MHz
- Pin Count
- 256
- Operating Supply Voltage
- 2.5V
- Temperature Grade
- INDUSTRIAL
- Interface
- Parallel
- Max Supply Voltage
- 2.6V
- Min Supply Voltage
- 2.4V
- Memory Size
- 4.5MB
- Number of Ports
- 2
- Nominal Supply Current
- 1.37A
- Memory Type
- RAM, SDR, SRAM
- Frequency (Max)
- 133MHz
- Access Time
- 4.2 ns
- Organization
- 1MX36
- Output Characteristics
- 3-STATE
- Address Bus Width
- 40b
- Density
- 36 Mb
- Standby Current-Max
- 0.08A
- I/O Type
- COMMON
- Sync/Async
- Synchronous
- Word Size
- 36b
- Length
- 17mm
- Width
- 17mm
- Thickness
- 1.76mm
Download datasheets and manufacturer documentation for Renesas 70T3509MS133BPI.
70T3509MS133BPI Overview
As far as its memory type goes, it falls into the RAM, SDR, SRAM category. You can get memory ics in a Bulk case. BGA case encloses it. There is 4.5MB of memory on the chip. There are 256 terminations on the chip. There are 1 functions supported by this part as part of the comprehensive working process. The memory device is designed to be supplied with an 2.5V volt power supply in order to operate properly. In this ic memory chip, there is an 256-pin package that encloses the device. It is worth noting that this memory device has 256 pins, which indicates it has 256 memory locations. This memory chip has an operating supply voltage of 2.5V. As a result of the Surface Mount mounting configuration, this chip is designed to be straightforward, high-efficiency, and easy to install. As far as the nominal supply current of this memory component is concerned, it is rated at 1.37A. Despite all its benefits, this memory chip also offers FLOW-THROUGH OR PIPELINED ARCHITECTURE for improved system performance. Using 2 ports, a single memory address can be read and/or written. A memory map of COMMON bits has been added to the I/O port addresses of this device. Memory ics must operate at a temperature of at least -40°C. Temperatures over 85°C°C are not recommended. There is a common misconception that this component is a type of SRAMs. If this part is to be used, the minimum supply voltage should not be less than 2.4V volts. The operating voltage of the memory ics shall not exceed 2.6V. There is an 133MHz frequency with which this memory chip processes data. In this Memory chip, the maximum frequency is 133MHz.
70T3509MS133BPI Features
Package / Case: BGA
256 Pins
Operating Supply Voltage:2.5V
Additional Feature:FLOW-THROUGH OR PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 133MHz
133MHz terminals
70T3509MS133BPI Applications
There are a lot of Integrated Device Technology (IDT)
70T3509MS133BPI Memory applications.
- multimedia computers
- networking
- personal computers
- servers
- supercomputers
- telecommunications
- workstations,
- DVD disk buffer
- data buffer
- nonvolatile BIOS memory
User Guide
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
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Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
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