INTEL 5CSXFC6C6U23C8NES
Manufacturer No:
5CSXFC6C6U23C8NES
Manufacturer:
INTEL
Package:
672-FBGA
Description:
0°C~85°C TJ 5CSXFC6 System On Chip Cyclone® V SX Series MCU - 181, FPGA - 145 I/O
Quantity:
In Stock :7619
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Thu, Jun 4 - Fri, Jun 5, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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User Guide
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PURCHASE
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Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
5CSXFC6C6U23C8NES Information
INTEL 5CSXFC6C6U23C8NES technical specifications, attributes, parameters and parts with similar specifications to INTEL 5CSXFC6C6U23C8NES.
- Type
- Parameter
- Package / Case
- 672-FBGA
- Supplier Device Package
- 672-UBGA (23x23)
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Cyclone® V SX
- Part Status
- Obsolete
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Base Part Number
- 5CSXFC6
- Number of I/O
- MCU - 181, FPGA - 145
- Speed
- 600MHz
- Type
- Parameter
- RAM Size
- 64KB
- Core Processor
- Dual ARM® Cortex®-A9 MPCore? with CoreSight?
- Peripherals
- DMA, POR, WDT
- Connectivity
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture
- MCU, FPGA
- Primary Attributes
- FPGA - 110K Logic Elements
Download datasheets and manufacturer documentation for INTEL 5CSXFC6C6U23C8NES.
Datasheets:
PCN Packaging:
This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processors in this SoC.This system on a chip is packaged as 672-FBGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Cyclone® V SX series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 110K Logic Elements.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of MCU - 181, FPGA - 145 I/Os.By searching 5CSXFC6, you can find system on chips with similar specs and purposes.
Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.
64KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
5CSXFC6C6U23C8NES System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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12.28 M
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3,000+
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