INTEL 5CSEBA2U23I7

Manufacturer No:

5CSEBA2U23I7

Manufacturer:

INTEL

Package:

672-FBGA

Description:

672 Terminations -40°C~100°C TJ 5CSEBA2 System On Chip Cyclone® V SE Series MCU - 181, FPGA - 145 I/O 1.1V

Quantity:

In Stock :8500

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Shipping & Availability

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Shipped from：HK Warehouse

Expected Shipping：Fri, Jun 5 - Sat, Jun 6, 2026

Lead Time：Inquire about availability

Date Code：Within 2 Years

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User Guide

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PURCHASE

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IMPORTANT NOTICE

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Step1：Prepare product

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step4：Individual Package

Step5：Anti-collision Filling

Step6：Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

5CSEBA2U23I7 Information

INTEL 5CSEBA2U23I7 technical specifications, attributes, parameters and parts with similar specifications to INTEL 5CSEBA2U23I7.

Type
Parameter

Factory Lead Time
8 Weeks

Package / Case
672-FBGA

Surface Mount
YES

Operating Temperature
-40°C~100°C TJ

Packaging
Tray

Series
Cyclone® V SE

Published
2018

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
672

Type
Parameter

Subcategory
Field Programmable Gate Arrays

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
NOT SPECIFIED

Supply Voltage
1.1V

Terminal Pitch
0.8mm

Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

Base Part Number
5CSEBA2

JESD-30 Code
S-PBGA-B672

Download datasheets and manufacturer documentation for INTEL 5CSEBA2U23I7.

Datasheets:

intel-5cseba2u23c7sn-datasheets-5533.pdf

intel-5cseba2u23c7sn-datasheets-5534.pdf

terasicinc-p0286-datasheets-0308.pdf

intel-5cseba2u23c7sn-datasheets-5536.pdf

PCN Packaging:

intel-em2130h01qi-pcnpackaging-0513.pdf

intel-em2130h01qi-pcnpackaging-0514.pdf

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).

A core processor Dual ARM® Cortex®-A9 MPCore? with CoreSight? is used to build this SoC.Its package is 672-FBGA.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Cyclone® V SE series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines FPGA - 25K Logic Elements.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are MCU - 181, FPGA - 145.A 1.1V power supply should be used.There are voltages higher than 1.13V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.07V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.Having 672 terminations in total makes system on a chip possible.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.It is possible to use this SoC chip with 145 outputs.You will need to provide 1.11.2/3.32.5V power supplies in order to run system on chip.A SoC chip with 145 inputs is available to the user.25000 logic cells are included in logic system on chips.Searching 5CSEBA2 will yield system on chips with similar specs and purposes.