INTEL 5CSEBA2U23A7N

Manufacturer No:

5CSEBA2U23A7N

Manufacturer:

INTEL

Package:

672-FBGA

Description:

672 Terminations -40°C~125°C TJ System On Chip Automotive, AEC-Q100, Cyclone® V SE Series MCU - 181, FPGA - 145 I/O 1.1V

Quantity:

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5CSEBA2U23A7N information

INTEL 5CSEBA2U23A7N technical specifications, attributes, parameters and parts with similar specifications to INTEL 5CSEBA2U23A7N.

Type
Parameter

Factory Lead Time
8 Weeks

Package / Case
672-FBGA

Surface Mount
YES

Operating Temperature
-40°C~125°C TJ

Packaging
Tray

Series
Automotive, AEC-Q100, Cyclone® V SE

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
672

HTS Code
8542.39.00.01

Subcategory
Field Programmable Gate Arrays

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
NOT SPECIFIED

Supply Voltage
1.1V

Terminal Pitch
0.8mm

Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

JESD-30 Code
S-PBGA-B672

Number of Outputs
145

Qualification Status
Not Qualified

Supply Voltage-Max (Vsup)
1.13V

Power Supplies
1.11.2/3.32.5V

Supply Voltage-Min (Vsup)
1.07V

Speed
700MHz

RAM Size
64KB

Core Processor
Dual ARM® Cortex®-A9 MPCore? with CoreSight?

Peripherals
DMA, POR, WDT

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Number of Inputs
145

Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes
FPGA - 25K Logic Elements

Number of Logic Cells
25000

Length
23mm

Height Seated (Max)
1.85mm

Width
23mm

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for INTEL 5CSEBA2U23A7N.

Datasheets:

intel-5cseba2u23a7n-datasheets-5634.pdf

PCN Packaging:

intel-em2130h01qi-pcnpackaging-0513.pdf

intel-em2130h01qi-pcnpackaging-0514.pdf

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).

Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore? with CoreSight?, this SoC has been developed.There is a 672-FBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Automotive, AEC-Q100, Cyclone® V SE is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~125°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 25K Logic Elements.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of MCU - 181, FPGA - 145 inputs and outputs.Ideally, a power supply with a voltage of 1.1V should be used.An excessive voltage of 1.13V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.07V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 672 terminations.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 145 outputs, which is convenient.There is 1.11.2/3.32.5V power supply requirement for this system on chip SoC.The SoC chip offers 145 inputs.System on chips of logic are comprised of 25000 logic cells.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.

64KB RAM.
Built on MCU, FPGA.

There are a lot of Intel

5CSEBA2U23A7N System On Chip (SoC) applications.

Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare
Medical
Remote control

User Guide

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