INTEL 5CEFA4F23C7N
Manufacturer No:
5CEFA4F23C7N
Manufacturer:
Package:
484-BGA
Description:
2mm mm FPGAs Cyclone® V E Series 484-BGA 1mm mm 484
Quantity:
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5CEFA4F23C7N Information
INTEL 5CEFA4F23C7N technical specifications, attributes, parameters and parts with similar specifications to INTEL 5CEFA4F23C7N.
- Type
- Parameter
- Factory Lead Time
- 8 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 484-BGA
- Surface Mount
- YES
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Cyclone® V E
- Published
- 2018
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Type
- Parameter
- Number of Terminations
- 484
- HTS Code
- 8542.39.00.01
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
- Voltage - Supply
- 1.07V~1.13V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Supply Voltage
- 1.1V
- Terminal Pitch
- 1mm
Download datasheets and manufacturer documentation for INTEL 5CEFA4F23C7N.
Datasheets:
5CEFA4F23C7N Description
The 5CEFA4F23C7N is a Cyclone® V device designed to simultaneously accommodate the shrinking power consumption, cost, and time-to-market requirements; and the increasing bandwidth requirements for high-volume and cost-sensitive applications.
5CEFA4F23C7N Features
Built on TSMC's 28 nm low-power (28LP) process technology and includes an abundance of hard intellectual property (IP) blocks
Up to 40% lower power consumption than the previous generation device
8-input adaptive logic module (ALM)
Up to 13.59 megabits (Mb) of embedded memory
Variable-precision digital signal processing (DSP) blocks
3.125 gigabits per second (Gbps) and 6.144 Gbps transceivers
Hard memory controllers
Tight integration of a dual-core Arm Cortex-A9 MPCore processor, hard IP, and an
FPGA in a single Cyclone V system-on-a-chip (5oC)
Supports over 128 Gbps peak bandwidth with integrated data coherency between the processor and the FPGA fabric
Requires only two core voltages to operate
Available in low-cost wirebond packaging
Includes innovative features such as Configuration via Protocol (CvP) and partial reconfiguration
5CEFA4F23C7N Applications
High-volume and cost-sensitive applications
5CEFA4F23C7N Relevant information
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