INTEL 5ASXMB3E4F31C4N
Manufacturer No:
5ASXMB3E4F31C4N
Manufacturer:
INTEL
Package:
896-BBGA, FCBGA
Description:
896 Terminations 0°C~85°C TJ 5ASXMB3 System On Chip Arria V SX Series MCU - 208, FPGA - 250 I/O 1.1V
Quantity:
In Stock :2332
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Shipping & Availability
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Shipped from：HK Warehouse
Expected Shipping：Wed, Jun 3 - Thu, Jun 4, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
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Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
5ASXMB3E4F31C4N Information
INTEL 5ASXMB3E4F31C4N technical specifications, attributes, parameters and parts with similar specifications to INTEL 5ASXMB3E4F31C4N.
- Type
- Parameter
- Factory Lead Time
- 8 Weeks
- Package / Case
- 896-BBGA, FCBGA
- Surface Mount
- YES
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Arria V SX
- JESD-609 Code
- e1
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 896
- Type
- Parameter
- Terminal Finish
- TIN SILVER COPPER
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Supply Voltage
- 1.1V
- Terminal Pitch
- 1mm
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Base Part Number
- 5ASXMB3
- JESD-30 Code
- S-PBGA-B896
- Supply Voltage-Max (Vsup)
- 1.13V
Download datasheets and manufacturer documentation for INTEL 5ASXMB3E4F31C4N.
Datasheets:
This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore? with CoreSight?, this SoC is built.Package 896-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Arria V SX.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.It is important to note that this SoC security combines FPGA - 350K Logic Elements.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 208, FPGA - 250 I/Os are included in this SoC part.A 1.1V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.13V.At least 1.07V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 896 terminations, which makes system on a chip possible.Search 5ASXMB3 for system on chips with similar specs and purposes.A 670MHz clock frequency is used by this SoC.
Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.
64KB RAM.
Built on MCU, FPGA.
Clock Frequency: 670MHz
There are a lot of Intel
5ASXMB3E4F31C4N System On Chip (SoC) applications.
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
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12.28 M
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