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INTEL 1SX250LU3F50E3VG
Manufacturer No:
1SX250LU3F50E3VG
Manufacturer:
INTEL
Package:
2397-BBGA, FCBGA
Description:
0°C~100°C TJ System On Chip Stratix® 10 SX Series 704 I/O
Quantity:
In Stock :6431
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Sun, Jun 7 - Mon, Jun 8, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Quality Assurance
Certified in-house inspection and testing facilities ensure all components meet internationally recognized quality standards.
User Guide
Available from AS9120 Certified Supplier, AIChipLink delivers high-reliability electronic components supported by certified quality management, rigorous inspection processes, counterfeit mitigation controls, and full traceability systems. Our operations comply with AS9120, ISO 9001:2015, and IECQ ESD standards to support aerospace, industrial, defense, and mission-critical applications.
PURCHASE
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
1SX250LU3F50E3VG Information
INTEL 1SX250LU3F50E3VG technical specifications, attributes, parameters and parts with similar specifications to INTEL 1SX250LU3F50E3VG.
- Type
- Parameter
- Factory Lead Time
- 12 Weeks
- Package / Case
- 2397-BBGA, FCBGA
- Operating Temperature
- 0°C~100°C TJ
- Packaging
- Tray
- Series
- Stratix® 10 SX
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of I/O
- 704
- Speed
- 1.5GHz
- RAM Size
- 256KB
- Type
- Parameter
- uPs/uCs/Peripheral ICs Type
- MICROPROCESSOR CIRCUIT
- Core Processor
- Quad ARM® Cortex®-A53 MPCore? with CoreSight?
- Peripherals
- DMA, WDT
- Connectivity
- EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture
- MCU, FPGA
- Primary Attributes
- FPGA - 2500K Logic Elements
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for INTEL 1SX250LU3F50E3VG.
PCN Packaging:
This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight? core processor(s).
A core processor Quad ARM® Cortex®-A53 MPCore? with CoreSight? is used to build this SoC.Its package is 2397-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Stratix® 10 SX series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.A key point to note is that this SoC security combines FPGA - 2500K Logic Elements.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 704.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.
Quad ARM® Cortex®-A53 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Intel
1SX250LU3F50E3VG System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
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