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INTEL 1SX250LH3F55E3VG
Manufacturer No:
1SX250LH3F55E3VG
Manufacturer:
INTEL
Package:
2912-BBGA, FCBGA
Description:
0°C~100°C TJ System On Chip Stratix® 10 SX Series 1160 I/O
Quantity:
In Stock :2717
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Thu, May 28 - Fri, May 29, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Quality Assurance
Certified in-house inspection and testing facilities ensure all components meet internationally recognized quality standards.
User Guide
Aichiplink operates certified in-house inspection and testing facilities to ensure all electronic components meet internationally recognized quality and compliance standards. Our quality management system is verified through ISO 9001 certification and industry-standard inspection procedures.
PURCHASE
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
1SX250LH3F55E3VG Information
INTEL 1SX250LH3F55E3VG technical specifications, attributes, parameters and parts with similar specifications to INTEL 1SX250LH3F55E3VG.
- Type
- Parameter
- Package / Case
- 2912-BBGA, FCBGA
- Operating Temperature
- 0°C~100°C TJ
- Packaging
- Tray
- Series
- Stratix® 10 SX
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of I/O
- 1160
- Speed
- 1.5GHz
- RAM Size
- 256KB
- uPs/uCs/Peripheral ICs Type
- MICROPROCESSOR CIRCUIT
- Type
- Parameter
- Core Processor
- Quad ARM® Cortex®-A53 MPCore? with CoreSight?
- Peripherals
- DMA, WDT
- Connectivity
- EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture
- MCU, FPGA
- Primary Attributes
- FPGA - 2500K Logic Elements
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for INTEL 1SX250LH3F55E3VG.
PCN Packaging:
This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore? with CoreSight?, this SoC has been developed.There is a 2912-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Stratix® 10 SX is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 2500K Logic Elements.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 1160 inputs and outputs.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.
Quad ARM® Cortex®-A53 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Intel
1SX250LH3F55E3VG System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
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