Texas Instruments 1B2G125DCURG4
Manufacturer No:
1B2G125DCURG4
Manufacturer:
Texas Instruments
Package:
Description:
2-ch, 0.8-V to 3.6-V low power buffers with 3-state outputs
Quantity:
In Stock :6794
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Expected Shipping：Sun, May 31 - Mon, Jun 1, 2026
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Date Code：Within 2 Years
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1B2G125DCURG4 Information
Texas Instruments 1B2G125DCURG4 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments 1B2G125DCURG4.
- Type
- Parameter
- Technology family
- AUP
- Supply voltage (min) (V)
- 0.8
- Supply voltage (max) (V)
- 3.6
- Number of channels
- 2
- IOL (max) (mA)
- 4
- Supply current (max) (µA)
- 0.9
- IOH (max) (mA)
- -4
- Input type
- Standard CMOS
- Output type
- 3-State
- Features
- Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns)
- Type
- Parameter
- Rating
- Catalog
- Operating temperature range (°C)
- -40 to 85
- Package
- DSBGA (YFP)
- Pins
- 8
- Size
- 1.8 mm² 1 x 1.8
- Package
- DSBGA (YZP)
- Pins
- 8
- Size
- 2.8125 mm² 2.25 x 1.25
- Package
- UQFN (RSE)
- Pins
- 8
Download datasheets and manufacturer documentation for Texas Instruments 1B2G125DCURG4.
Data sheet:
Application brief:
Selection guide:
Application note:
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).
The SN74AUP2G125 is a dual bus buffer gate designed for 0.8-V to 3.6-V VCC operation. This device features dual line drivers with 3-state outputs. Each output is disabled when the corresponding output-enable (OE) input is high. This device has the input-disable feature, which allows floating input signals.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
- Available in the Texas Instruments NanoStar™ Package
- Low Static-Power Consumption
(ICC = 0.9 µA Max) - Low Dynamic-Power Consumption
(Cpd = 4 pF Typ at 3.3 V) - Low Input Capacitance (CI = 1.5 pF Typ)
- Low Noise – Overshoot and Undershoot
<10% of VCC - Input-Disable Feature Allows Floating Input Conditions
- Ioff Supports Partial-Power-Down Mode Operation
- Input Hysteresis Allows Slow Input Transition and Better Switching
Noise Immunity at Input - Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 5.4 ns Max at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
NanoStar is a trademark of Texas Instruments
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