INTEL 10AS016E3F29E2LG

Manufacturer No:

10AS016E3F29E2LG

Manufacturer:

INTEL

Package:

780-BBGA, FCBGA

Description:

780 Terminations 0°C~100°C TJ System On Chip Arria 10 SX Series 288 I/O 0.9V

Quantity:

Delivery:

Payment:

In Stock :Available

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10AS016E3F29E2LG information

INTEL 10AS016E3F29E2LG technical specifications, attributes, parameters and parts with similar specifications to INTEL 10AS016E3F29E2LG.

Type
Parameter

Factory Lead Time
8 Weeks

Package / Case
780-BBGA, FCBGA

Surface Mount
YES

Operating Temperature
0°C~100°C TJ

Packaging
Tray

Series
Arria 10 SX

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
780

HTS Code
8542.39.00.01

Subcategory
Field Programmable Gate Arrays

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
NOT SPECIFIED

Supply Voltage
0.9V

Terminal Pitch
1mm

Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

JESD-30 Code
S-PBGA-B780

Number of Outputs
288

Qualification Status
Not Qualified

Supply Voltage-Max (Vsup)
0.93V

Power Supplies
0.9V

Supply Voltage-Min (Vsup)
0.87V

Speed
1.5GHz

RAM Size
256KB

Core Processor
Dual ARM® Cortex®-A9 MPCore? with CoreSight?

Peripherals
DMA, POR, WDT

Connectivity
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Number of Inputs
288

Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes
FPGA - 160K Logic Elements

Number of Logic Cells
160000

Length
29mm

Height Seated (Max)
3.35mm

Width
29mm

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for INTEL 10AS016E3F29E2LG.

Datasheets:

terasicinc-p0578-datasheets-5343.pdf

terasicinc-p0578-datasheets-5344.pdf

PCN Packaging:

intel-em2130h01qi-pcnpackaging-0513.pdf

intel-em2130h01qi-pcnpackaging-0514.pdf

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).

A core processor(s) Dual ARM® Cortex®-A9 MPCore? with CoreSight? is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 780-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Arria 10 SX is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.This SoC security combines FPGA - 160K Logic Elements, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.288 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 0.9V.The SoCs wireless cannot operate at a voltage greater than 0.93V because it is considered unsafe for the application.If it has at least a 0.87V volt power supply, it can work fine.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 780 terminations, so system on a chip is really aided by this.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.There is the option to have 288 outputs on this SoC chip.As far as power supplies are concerned, system on chip requires 0.9V.Inputs are available on the SoC chip in the number of 288.There are 160000 logic cells in the logic system on chips.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.

There are a lot of Intel

10AS016E3F29E2LG System On Chip (SoC) applications.

POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness

User Guide

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