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Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
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Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
MICRON MT29F1G08ABBDAH4:D technical specifications, attributes, parameters and parts with similar specifications to MICRON MT29F1G08ABBDAH4:D.
Download datasheets and manufacturer documentation for MICRON MT29F1G08ABBDAH4:D.
Product Description:
The MT29F1G08ABBDAH4:D is a 1Gb (128M x 8) parallel flash memory device manufactured by Micron Technology Inc. This surface-mount, 63-pin VFBGA packaged IC is designed for use in a variety of applications where high-density, non-volatile memory is required.
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FAQs:
Q: What is the operating temperature range of the MT29F1G08ABBDAH4:D? A: The operating temperature range is 0°C to 70°C.
Q: What is the packaging type of the MT29F1G08ABBDAH4:D? A: The packaging type is 63-VFBGA.
Q: Is the MT29F1G08ABBDAH4:D radiation-hardened? A: No, the MT29F1G08ABBDAH4:D is not radiation-hardened.
Q: What is the factory lead time for the MT29F1G08ABBDAH4:D? A: The factory lead time is approximately 3 weeks.
Q: Is the MT29F1G08ABBDAH4:D RoHS compliant? A: Yes, the MT29F1G08ABBDAH4:D is RoHS3 compliant.
Q: What is the moisture sensitivity level (MSL) of the MT29F1G08ABBDAH4:D? A: The MSL is level 3, requiring storage in a controlled environment for up to 168 hours.
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number3,000+
Leading Manufacturers4.9 M
In-stock SKU15,000+
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