Microchip M2S050T-FGG896ES
Manufacturer No:
M2S050T-FGG896ES
Manufacturer:
Microchip
Package:
896-BGA
Description:
0°C~85°C TJ M2S050 System On Chip SmartFusion®2 Series 377 I/O
Quantity:
In Stock :6114
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Shipped from：HK Warehouse
Expected Shipping：Thu, Jun 11 - Fri, Jun 12, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
M2S050T-FGG896ES Information
Microchip M2S050T-FGG896ES technical specifications, attributes, parameters and parts with similar specifications to Microchip M2S050T-FGG896ES.
- Type
- Parameter
- Package / Case
- 896-BGA
- Supplier Device Package
- 896-FBGA (31x31)
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- SmartFusion®2
- Published
- 2016
- Part Status
- Obsolete
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Max Operating Temperature
- 85°C
- Min Operating Temperature
- 0°C
- Type
- Parameter
- Frequency
- 166MHz
- Base Part Number
- M2S050
- Interface
- CAN, Ethernet, I2C, SPI, UART, USART, USB
- Number of I/O
- 377
- Speed
- 166MHz
- RAM Size
- 64KB
- Core Processor
- ARM® Cortex®-M3
- Peripherals
- DDR, PCIe, SERDES
- Connectivity
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Architecture
- MCU, FPGA
Download datasheets and manufacturer documentation for Microchip M2S050T-FGG896ES.
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor(s) ARM® Cortex®-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 896-BGA.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion®2 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.This SoC security combines FPGA - 50K Logic Modules, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.377 I/Os are available in this SoC part.The flash size of the SoC meaning is 256KB.A search for M2S050 will result in system on chips that have similar specs and purposes.A frequency of 166MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.Just 0°C is needed to get the SoC computing up and running.As far as the design temperature of this SoC system on chip is concerned, the maximum working temperature is 85°C.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S050T-FGG896ES System On Chip (SoC) applications.
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
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