INTEL EPM1270GF256C3

Manufacturer No:

EPM1270GF256C3

Manufacturer:

INTEL

Package:

256-BGA

Description:

1.5/3.31.8V 1mm PMIC MAX® II Series EPM1270 1.8V 256-BGA

Quantity:

In Stock :1200

Looking for price or availability? Send us an RFQ and our sales team will respond quickly.

Shipping & Availability

Fast worldwide shipping via DHL, FedEx, UPS, and EMS.

Shipped from：HK Warehouse

Expected Shipping：Tue, Jun 9 - Wed, Jun 10, 2026

Lead Time：Inquire about availability

Date Code：Within 2 Years

Payment

We support multiple secure payment methods including PayPal, Visa, MasterCard, and American Express. All transactions are protected with advanced encryption to ensure secure and reliable payments.

Authenticity Guarantee

All components supplied by Aichiplink are sourced from trusted global suppliers and verified through strict in-house inspection and quality control procedures.

Quality Assurance

Certified in-house inspection and testing facilities ensure all components meet internationally recognized quality standards.

User Guide

Available from AS9120 Certified Supplier, AIChipLink delivers high-reliability electronic components supported by certified quality management, rigorous inspection processes, counterfeit mitigation controls, and full traceability systems. Our operations comply with AS9120, ISO 9001:2015, and IECQ ESD standards to support aerospace, industrial, defense, and mission-critical applications.

PURCHASE

Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.

MEANS OF PAYMENT

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.

RFQ (REQUEST FOR QUOTATIONS)

Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1：Prepare product

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step4：Individual Package

Step5：Anti-collision Filling

Step6：Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

EPM1270GF256C3 Information

INTEL EPM1270GF256C3 technical specifications, attributes, parameters and parts with similar specifications to INTEL EPM1270GF256C3.

Type
Parameter

Factory Lead Time
8 Weeks

Mounting Type
Surface Mount

Package / Case
256-BGA

Surface Mount
YES

Operating Temperature
0°C~85°C TJ

Packaging
Tray

Series
MAX® II

JESD-609 Code
e0

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Type
Parameter

Number of Terminations
256

ECCN Code
3A991

Terminal Finish
TIN LEAD

Additional Feature
YES

HTS Code
8542.39.00.01

Subcategory
Programmable Logic Devices

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
220

Download datasheets and manufacturer documentation for INTEL EPM1270GF256C3.

Datasheets:

intel-epm240t100a5n-datasheets-8569.pdf

intel-epm240t100a5n-datasheets-8570.pdf

intel-epm240t100a5n-datasheets-8571.pdf

PCN Packaging:

intel-dcf0484wn1n-pcnpackaging-9266.pdf

intel-dcf0484wn1n-pcnpackaging-9267.pdf

intel-em2130h01qi-pcnpackaging-0513.pdf

intel-em2130h01qi-pcnpackaging-0514.pdf

EPM1270GF256C3 Overview

The mobile phone network has 980 macro cells, which are cells that provide radio coverage from high-power cell sites (towers, antennas, or masts).In the 256-BGA package, you will find it.In this case, there are 212 I/Os programmed.256 terminations are programmed into the device.This electrical component has a terminal position of BOTTOM.An electrical supply voltage of 1.8V is used to power it.The part belongs to Programmable Logic Devices family.Tray should be used to package the chip.Due to its reliability, it is operated at a temperature of 0°C~85°C TJ.There should be a Surface Mount on the chip.The FPGA belongs to the MAX® II series.This device also displays YES.The EPM1270 shows its related parts.1270logic blocks/elements are present.This device runs on 1.5/3.31.8V volts of electricity.There is a maximum supply voltage (Vsup) of 1.89V.If the supply voltage (Vsup) is greater than 1.71V, then the device will work properly.