INTEL 10AS048K3F35I2SG

Manufacturer No:

10AS048K3F35I2SG

Manufacturer:

INTEL

Package:

1152-BBGA, FCBGA

Description:

-40°C~100°C TJ System On Chip Arria 10 SX Series 396 I/O 0.9V

Quantity:

In Stock :7005

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Shipped from：HK Warehouse

Expected Shipping：Tue, Jun 9 - Wed, Jun 10, 2026

Lead Time：Inquire about availability

Date Code：Within 2 Years

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Step1：Prepare product

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step4：Individual Package

Step5：Anti-collision Filling

Step6：Packaging Box

SHIPPING COST

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2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

10AS048K3F35I2SG Information

INTEL 10AS048K3F35I2SG technical specifications, attributes, parameters and parts with similar specifications to INTEL 10AS048K3F35I2SG.

Type
Parameter

Factory Lead Time
11 Weeks

Package / Case
1152-BBGA, FCBGA

Surface Mount
YES

Operating Temperature
-40°C~100°C TJ

Packaging
Tray

Series
Arria 10 SX

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

HTS Code
8542.39.00.01

Subcategory
Field Programmable Gate Arrays

Type
Parameter

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
NOT SPECIFIED

Supply Voltage
0.9V

Terminal Pitch
1mm

Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

JESD-30 Code
S-PBGA-B1152

Number of Outputs
396

Qualification Status
Not Qualified

Download datasheets and manufacturer documentation for INTEL 10AS048K3F35I2SG.

Datasheets:

terasicinc-p0578-datasheets-5343.pdf

terasicinc-p0578-datasheets-5344.pdf

terasicinc-p0578-datasheets-5344.pdf

PCN Packaging:

intel-em2130h01qi-pcnpackaging-0513.pdf

intel-em2130h01qi-pcnpackaging-0514.pdf

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).

On this SoC, there is Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor.Assigned with the package 1152-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Arria 10 SX series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 480K Logic Elements.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 396 I/Os.It is recommended to use a 0.9V power supply.In the SoCs wireless, voltages above 0.93V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 0.87V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.There are 396 outputs available on this SoC.A power supply of 0.9V is required to run system on chip.On the SoC chip, there are 396 inputs available for use.Logic system on chips consist of 480000 logic cells.